Differences Between PCB Layers

When designing a PCB, I found that many people, especially beginners, do not have a clear understanding of the layers in a PCB. Therefore, today let’s take a look at the differences between the various layers when using the software Altium Designer to create a board.

1. Signal Layer

The signal layer is divided into Top Layer (top layer) and Bottom Layer (bottom layer), which are the layers that have electrical connections, allowing components to be placed and traces to be routed.

Differences Between PCB Layers

2. Mechanical Layer

The Mechanical (mechanical layer) defines the appearance of the entire PCB. The emphasis on “mechanical” means that it does not have electrical properties, so it can be safely used to outline the shape, outline mechanical dimensions, place text, etc., without worrying about altering the electrical characteristics of the board. A maximum of 16 mechanical layers can be selected.

3. Silkscreen Layer

Top Overlay (top silkscreen layer) and Bottom Overlay (bottom silkscreen layer) are used to define the silkscreen characters on the top and bottom layers, which are the text symbols printed above the solder mask, such as component names, component symbols, component pins, and copyrights, facilitating future circuit soldering and troubleshooting.

Differences Between PCB Layers

4. Paste Layer

The paste layer includes the top paste layer (Top Paste) and the bottom paste layer (Bottom Paste), referring to the surface mount pads that are exposed and require solder paste before soldering. Therefore, this layer is also useful during hot air leveling of the pads and making soldering stencils.
Differences Between PCB Layers

5. Solder Mask Layer

The solder mask layer, often referred to as “window opening”, includes the top solder mask layer (Top Solder) and the bottom solder mask layer (Bottom Solder). Its function is the opposite of the paste layer, referring to the layer that is covered with green oil. This layer does not adhere solder, preventing excess solder from shorting adjacent solder points during soldering. The solder mask covers the copper traces to prevent rapid oxidation in the air, leaving openings at the solder points and not covering them.

Differences Between PCB Layers

Regular copper cladding or routing is usually covered with green oil by default. If we process the corresponding area in the solder mask layer, it will prevent the green oil from covering and expose the copper.

6. Drill Layer

The drill layer includes Drill Grid (drill indicator diagram) and Drill Drawing (drill diagram) two drill layers, which provide drilling information during the PCB manufacturing process (such as pads and vias that require drilling).

Differences Between PCB Layers

7. Keep Out Layer

The keep out layer (Keep Out Layer) is used to define the boundaries of routing layers. Once the keep out layer is defined, in future routing processes, the routing with electrical properties cannot exceed the boundaries of the keep out layer.

Differences Between PCB Layers

8. Multi-layer

Multi layer (多层), the pads and through-hole vias on the circuit board must penetrate the entire circuit board to establish electrical connections with different conductive pattern layers. Therefore, a special abstract layer is set up—multi-layer. Generally, pads and vias should be set on the multi-layer, if this layer is closed, pads and vias will not be displayed.

Differences Between PCB Layers

Source: Electronic Circuits
Copyright belongs to the original author, please contact for deletion if there is any infringement.

Leave a Comment