A Heterogeneous System-Level Package Integrating FPGA and DSP Chiplets
Abstract: Integrating multiple heterogeneous chiplets into a package is a promising and cost-effective strategy that can build flexible and scalable systems and effectively accelerate diverse workloads. Based on this, we propose Arvon, which integrates a 14nm FPGA chiplet and two closely packed high-performance 22nm DSP chiplets using embedded multi-chip interconnect bridges (EMIBs). The chiplets are … Read more