AIB

A Heterogeneous System-Level Package Integrating FPGA and DSP Chiplets

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A Heterogeneous System-Level Package Integrating FPGA and DSP Chiplets

Follow us for more exciting discoveries! ▌This article is from Semiconductor Industry Observation Abstract: Integrating multiple heterogeneous chiplets into a package is a promising and cost-effective strategy that can build flexible and scalable systems while effectively accelerating diverse workloads. Based on this, we propose Arvon, which integrates a 14nm FPGA chiplet and two closely packed … Read more

A Heterogeneous System-Level Package Integrating FPGA and DSP Chiplets

by
A Heterogeneous System-Level Package Integrating FPGA and DSP Chiplets

Abstract: Integrating multiple heterogeneous chiplets into a package is a promising and cost-effective strategy that can build flexible and scalable systems and effectively accelerate diverse workloads. Based on this, we propose Arvon, which integrates a 14nm FPGA chiplet and two closely packed high-performance 22nm DSP chiplets using embedded multi-chip interconnect bridges (EMIBs). The chiplets are … Read more