Multi-stackup

Detailed Explanation of Rigid-Flex Layered Design

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Detailed Explanation of Rigid-Flex Layered Design

Source: SiP and Advanced Packaging Technology Author: Suny Li The three main characteristics of Rigid-Flex circuits are Multi-bending, Multi-stackup, and Multi-zone. In this article, we will take a detailed look at the multi-layered design of Rigid-Flex. 01 Multi-Stackup Multi-Stackup Multi-stackup refers to different numbers of layers and thicknesses in different areas of the substrate, meaning … Read more

Rigid-Flex Circuit Multi-Zone and Material Analysis

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Rigid-Flex Circuit Multi-Zone and Material Analysis

Article Source: SiP and Advanced Packaging Technology Original Author: Suny Li Rigid-Flex circuits have three basic characteristics: Multi-bending, Multi-stackup, and Multi-zone. Additionally, material selection is also an important aspect of Rigid-Flex design. Multi-stackup design refers to using different stacking structures in different areas of the substrate, with varying layer counts and thicknesses. So, how do … Read more