Rigid-Flex Circuit Multi-Zone and Material Analysis
Article Source: SiP and Advanced Packaging Technology Original Author: Suny Li Rigid-Flex circuits have three basic characteristics: Multi-bending, Multi-stackup, and Multi-zone. Additionally, material selection is also an important aspect of Rigid-Flex design. Multi-stackup design refers to using different stacking structures in different areas of the substrate, with varying layer counts and thicknesses. So, how do … Read more