Recommended Microcontrollers for Wireless Bluetooth Headphones

Recommended Microcontrollers for Wireless Bluetooth Headphones

In the field of wireless Bluetooth headphones, the microcontroller serves as the core control unit, and its selection directly affects the performance, power consumption, stability, and user experience of the headphones. This article will recommend several mainstream models available in the market to assist engineers in making better decisions. 1. Qualcomm QCC5141/QCC5144 Positioning: High-end Bluetooth … Read more

40th Anniversary of FPGA: Can Domestic Solutions Take the Lead?

40th Anniversary of FPGA: Can Domestic Solutions Take the Lead?

In the embedded field, FPGAs are a very important type of device. Today, AMD announced the 40th anniversary of the first commercial Field Programmable Gate Array (FPGA) being introduced. What stories lie behind FPGAs, what is the current development situation domestically and internationally, and can domestic FPGAs take the lead? From Replacing ASICs to Edge … Read more

Can Jetson Still Compete? A Comparative Review of 6 AI Embedded Devices to Help You Choose the Right Board!

Can Jetson Still Compete? A Comparative Review of 6 AI Embedded Devices to Help You Choose the Right Board!

✦ ✧ Introduction ✦ In today’s world where artificial intelligence (AI) is rapidly moving towards edge computing, AI is no longer confined to the large computing power of data centers but is increasingly deployed in compact, efficient, and intelligent embedded devices. From autonomous driving and industrial inspection to smart security and robotic control, the performance … Read more

Honoring Classics, Inspiring the Future: Innovative Breakthroughs in High-Performance Embedded Core Boards

Honoring Classics, Inspiring the Future: Innovative Breakthroughs in High-Performance Embedded Core Boards

In 2021, with the maturity of 5G, AIoT, and machine vision technologies, industrial scenarios demand more stringent requirements for device computing power, reliability, and multimodal interaction. AI localized deployment has become a necessity, as traditional cloud processing struggles to meet real-time requirements; Multi-sensor fusion (visual, audio, control) has given rise to heterogeneous computing architectures; Harsh … Read more

Key Technologies for Embedded Development Engineers in the AIoT Era

Key Technologies for Embedded Development Engineers in the AIoT Era

In traditional embedded development, electronic engineers need to focus on software development and hardware fundamentals. However, with the evolution of technology, emerging fields such as Artificial Intelligence (AI) and the Internet of Things (IoT) have significantly transformed embedded development. So, what technologies should engineers pay attention to today? 1. Edge Computing and AI Deployment Model … Read more

10 AI Money-Making Projects Accessible to the Average Person in 2025

10 AI Money-Making Projects Accessible to the Average Person in 2025

In this rapidly evolving era of artificial intelligence, AI technology is no longer an unattainable concept but has created numerous money-making opportunities for the average person. Below are 10 AI projects that anyone can start in 2025. 1. AI Writing and Content Creation In the age where content is king, both businesses and individual content … Read more

Competing for ASIC Opportunities: The Five Major PCB Manufacturers Showcase Their Strengths

With cloud service providers (CSP) actively developing self-researched chips (ASIC),ASIC is becoming an important architecture parallel to AI in the server market, driving the demand for high-end PCB materials. The five major PCB manufacturers, including Zhen Ding, Unimicron, Kinsus, Kingboard, and Boin, have all participated in the ASIC application supply chain and are showing clear … Read more

Alphawave’s First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

Alphawave's First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

On June 5, semiconductor IP company Alphawave Semi announced that its UCIe IP subsystem has successfully taped out, utilizing TSMC’s 2nm (N2) process, supporting a 36G Die-to-Die data rate. This IP is fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. This milestone builds on … Read more

Inphi Completes 7nm Full-Chip Flattened Design Tape-Out with Tempus Timing Signoff, Reducing Time to Market

Inphi Completes 7nm Full-Chip Flattened Design Tape-Out with Tempus Timing Signoff, Reducing Time to Market

Inphi is a leader in high-speed data movement interconnects, dedicated to rapidly transferring large data sets globally, between data centers and within data centers. We have adopted Tempus ECO and Tempus Signoff across all advanced process node projects. Due to the large scale of the designs, we chose to run flattened static timing analysis (STA) … Read more

PCB Giant: Dual-Driven Growth through Technology and Globalization, Valuation Recovery and Performance Growth Resonance

PCB Giant: Dual-Driven Growth through Technology and Globalization, Valuation Recovery and Performance Growth Resonance

1. Company Fundamentals: Performance Reversal Imminent, Valuation at Historical Low 1. Financial Data Overview Oshkosh (002913) achieved a revenue of 4.566 billion yuan in 2024 (up 5.45% year-on-year), but the net profit attributable to shareholders decreased by 31.88% to 353 million yuan due to rising raw material prices, exchange rate fluctuations, and initial production costs … Read more