The China Semiconductor Industry Association announced an important policy adjustment on April 11, 2025, changing the certification standard for the origin of integrated circuits from “packaging location” to “wafer fabrication location.” This new regulation is expected to accelerate the migration of global chip companies’ wafer fabrication processes to mainland China, bringing a significant influx of … Read more
May. Click the blue text to follow us 2025.05 About a month ago, we shared an article discussing the sharp decline in the success rate of chip tape-outs. For more details, refer to the article titled “Chips, Historical Low Points”. In response to this issue, Brian Bailey, editor of Semiconductor Engineering, stated that this is … Read more
About a month ago, the Semiconductor Industry Observer WeChat account shared an article discussing the sharp decline in the success rate of first-time chip tape-outs. For more details, refer to the article titled “Chips at a Historical Low”. In response to this issue, Brian Bailey, editor of Semiconductor Engineering, stated that this is just the … Read more
Case IntroductionSmart Bracelet PCBAFunction Overview1. Health Monitoring Features Heart Rate Monitoring: Real-time detection of the user’s heart rate changes through built-in optical or capacitive sensors, providing heart rate data, heart rate zones, and alerts. Sleep Monitoring: Analyzes the user’s sleep patterns, including deep sleep, light sleep, and awake time, providing sleep quality assessments and improvement … Read more
To alleviate the inventory pressure caused by returns of electronic products, Du and Wang devised a scheme to deliberately damage product circuit boards by applying high current, burning out components, and then claiming “quality issues” to exchange for new products, thereby committing fraud. Recently, the Haidian Court sentenced defendants Du and Wang to three years … Read more
Key Technical Field: This involves the field of electronic products, particularly the design and manufacturing technology of rigid-flex circuit boards. Overview of Background Technology: With the continuous development of consumer electronic products, the requirements for circuit boards are becoming increasingly high, including aspects such aslightweight, easy assembly, signal transmission speed, and product reliability. The rigid-flex … Read more
Pengding Holdings has disclosed a flexible circuit board and its manufacturing method. The core innovation of this circuit board lies in the adoption of a unique dielectric structure, which uses air filled in a closed cavity as the primary medium surrounding the signal transmission lines. Compared to traditional dielectric materials, air has a lower dielectric … Read more
Some screenshots of electronic books 【Complete Set of Hardware Learning Materials Collection】
Guide to Flexible Circuit Boards and Their Manufacturing Methods Overview This guide aims to help you review and understand the structure of flexible circuit boards and their manufacturing methods as described. The patent discloses a design for flexible circuit boards intended to reduce high-frequency signal transmission losses by introducing air-filled sealed cavities to minimize dielectric … Read more
Pengding Holdings involves a new type of flexible printed circuit board and its manufacturing method, which features a double-sided gold finger design aimed at improving space utilization and overcoming the limitations of existing single-sided gold finger flexible circuit boards in achieving circuit layout. Key Ideas/Facts: Double-Sided Gold Finger Design: The most significant feature of Pengding … Read more