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In simple terms, the PCBA process is a combination of the SMT processing and DIP processing.
Depending on the requirements of different production technologies, it can be divided into single-sided SMT assembly processes, single-sided DIP insertion processes, single-sided mixed assembly processes, single-sided assembly and insertion mixed processes, double-sided SMT assembly processes, and double-sided mixed assembly processes, etc.
The PCBA process involves processes such as substrate, printing, chip mounting, reflow soldering, insertion, wave soldering, testing, and quality inspection, as detailed in the following PCBA process flow chart.
Different types of PCB boards have various differences in their process flows; the following elaborates on these differences in detail.
1. Single-sided SMT Assembly
Apply solder paste to the component pads; after the solder paste printing is completed on the bare PCB, related electronic components are mounted through reflow soldering, followed by reflow soldering.
2. Single-sided DIP Insertion
The PCB boards that require insertion are manually inserted with electronic components by production line workers and then passed through wave soldering. After soldering is fixed, the leads are trimmed and the board is cleaned. However, wave soldering has lower production efficiency.
3. Single-sided Mixed Assembly
The PCB board undergoes solder paste printing, mounts electronic components, and is fixed by reflow soldering. After quality inspection, it undergoes DIP insertion and then wave soldering or manual soldering. If there are few through-hole components, manual soldering is recommended.
4. Mixed Assembly of Surface Mount and Insertion
Some PCB boards are double-sided, one side for surface mounting and the other side for insertion. The assembly process for surface mounting and insertion is the same as single-sided processing, but the PCB board needs to use fixtures when passing through reflow soldering and wave soldering.
5. Double-sided SMT Assembly
Certain PCB board design engineers use double-sided assembly methods to ensure the aesthetics and functionality of the PCB. The A side arranges IC components, while the B side mounts chip components. This fully utilizes the space of the PCB board, minimizing its area.
6. Double-sided Mixed Assembly
Double-sided mixed assembly has the following two methods: the first method is PCBA assembly with three heating processes, which has lower efficiency, and using red glue process for wave soldering has a lower pass rate and is not recommended. The second method is suitable for situations with many double-sided SMD components and few THT components, manual soldering is recommended. If there are many THT components, wave soldering is recommended.
The above is a simplified view of the PCBA assembly process for printed circuit boards, presented in a graphical format. However, as the PCBA assembly process and production processes are gradually optimized, the defect rate continues to decrease, ensuring the production of high-quality finished products. The quality of all solder joints of the aforementioned electronic components determines the quality of the PCBA board. Therefore, when related electronic manufacturers seek PCBA assembly processing vendors, it is best to require those with rich experience and high-level processing equipment.
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