Source: Lattice Semiconductor
Original Author: Lattice Semiconductor
This article briefly introduces some professional terms in the semiconductor field.
Wafer: The most basic processing unit in the semiconductor manufacturing industry, where circuit diagrams are etched onto wafers through specific processing techniques and then cut into IC chips;
Cassette: A box used to hold wafers, composed of separate slots; generally, one cassette can hold 25 wafers; wafers are processed in units of cassettes.
Chip: A part that is split from a wafer containing a device or circuit array, which at least contains one circuit;
Substrate: The material on which devices or circuit elements are manufactured on its surface and inside;
Substrate: Sheet material that forms the supporting base for film circuit components and/or external components;
Film: A solid layer formed on a solid substrate using any deposition process;
Thin Film: A film deposited on a substrate using growth processes such as vacuum evaporation, sputtering, and chemical vapor deposition;
Thick Film: A film typically deposited on a substrate using screen printing techniques;
Plated Film: A film obtained through chemical and/or electrochemical deposition;
Epitaxy Technique: The process of growing a layer of semiconductor material on a substrate that has the same or similar crystal phase;
Photolithography Technique: The process of creating the desired pattern on a wafer coated with a photoresist film using techniques such as exposure, development, and etching;
Vacuum Evaporation: The process of heating materials in a vacuum and allowing them to evaporate and deposit on the surface of other materials to form a film;
Diffusion Technique: The process of diffusing impurity atoms into a semiconductor crystal to form P-type or N-type conductivity regions within the crystal;
Ion Implantation: The process of injecting accelerated ions into a semiconductor crystal to form P-type, N-type, or intrinsic conductive regions within the crystal;
Sputtering: The process of using gas ions in a glow discharge to bombard electrode materials, releasing them and depositing them on the surface of other materials to form a film;
Metallization: The process of depositing a layer of metal film and creating wiring patterns to form the required internal connections;
Surface Passivation: The process of growing or coating a protective film on the surface of a semiconductor after the formation of P regions, N regions, and PN junctions;
Protective Coating: An insulating material layer applied to the surface of circuit components for mechanical protection and to prevent contamination;
Wire Bonding: The process of applying stress to form ohmic contact between fine metal wires and specified metallized areas on the chip or base;
Encapsulation: A general process of encapsulating circuits and components with a protective medium to resist mechanical, physical, and chemical stresses;
Embedding: The process of embedding the main body of circuits and components using a curable resin;
Package: The fully or partially encapsulated body of an integrated circuit;
Header: The part of the package used to mount the semiconductor chip;
Lot/Batch: A quantification unit for wafers, generally one wafer box contains 1 Lot; multiple Lots can form a Batch;
Port: Refers to a platform on the machine where wafers are placed before processing; the machine will use an automatic arm to extract them one by one for processing;
FAB: Specifically refers to the semiconductor industry processing workshop, which differs from ordinary processing workshops due to its extremely high environmental quality requirements;
SECS: The semiconductor automation standard protocol that regulates the communication standards for EAP control machines.
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It does not represent the position of the Semiconductor Institute of the Chinese Academy of Sciences
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