Recently, according to the “China Optics Valley” WeChat public account, thefirst domestically produced silicon photonic PDK (Process Design Kit), TDK (Test Design Kit), and ADK (Assembly Design Kit) wafer service platform based on a 12-inch 40nm CMOS process line has officially been launched in Optics Valley.
This platform is operated by the National Information Optoelectronics Innovation Center (NOEIC) and marks another key breakthrough for companies in Optics Valley in the field of silicon photonics.
It is reported that traditional chips rely on electronic data transmission, akin to trucks transporting goods, while silicon photonic chips allow photons to travel through optical fibers, transforming into a “light-speed high-speed train.”
The platform innovatively constructs a silicon photonic MPW service model,integrating multiple chip designs onto the same wafer, achieving cost sharing and significantly lowering the R&D threshold.
Silicon photonic chips from the National Information Optoelectronics Innovation Center
The platform’s performance based on the 40nm process for silicon photonic PDK1.0 meets commercial requirements overall,with processing accuracy, waveguide loss, and optical coupling efficiency reaching internationally advanced levels.
It is understood that in addition to PDK, the platform also integrates TDK and ADK, providing full-process support from integrated design to packaging verification, meeting the rapid iteration needs in scientific research results transformation and product development.
Processing scene of silicon photonic chips at the National Information Optoelectronics Innovation Center
In recent years, with the maturity of technology and the explosion of AI demand, silicon photonic chips have seen large-scale applications in cutting-edge industries such as artificial intelligence and big data.
Consulting agency LightCounting predicts that by 2030, the market share of silicon photonic chips in the optical communication chip market will increase to 60%.
