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Connecting electronic components and devices according to a predetermined design to form a specific electrical function.
Electronic Circuit
Connecting electronic components and devices according to a predetermined design, including circuit boards and component assembly, to form the functional parts of electronic devices.
Printed Circuit
Forming printed lines or printed components on an insulating substrate according to a predetermined design, as well as conductive patterns combining both.
Printed Wiring
Conductive patterns formed on an insulating substrate for connections between components, excluding printed components.
Printed Electronics; Printable Electronics
Using printing technology to transfer coatings with corresponding functions onto substrates, thereby forming electronic components and circuits.
Printed Electronic Circuit; PEC
Electronic circuit products manufactured using printing technology.
Flexible Electronics
Flexible Electronics
Printed electronic products made from flexible substrates that can be bent and folded.
Flexible Hybrid Electronics; FHE
Electronic products made from flexible substrates that print electronic components and circuits and can be bent and folded.
Hybrid Circuit
An electronic circuit composed of thin film conductors, thin film components, semiconductor chips, passive components, and bonding wires interconnected on an insulating substrate.
Thick-Film Circuit
A type of microcircuit formed on a substrate by screen printing and sintering, where the passive components are usually made of ceramics and metals.
Thick-Film Hybrid Circuit
A circuit that includes thick-film components and their interconnections.
Thin-Film Circuit
A microcircuit made by attaching thin film materials with special electrical properties to a substrate, containing thin-film passive components.
Thin-Film Hybrid Circuit
A circuit that includes thin-film components and their interconnections.
Analog Circuit
A circuit that provides a continuous relationship between input and output for the transmission, transformation, processing, amplification, measurement, and display of analog signals.
Digital Circuit
A circuit that completes the transmission and processing of digital signals providing two (binary) or three distinct relationships (states) between input and output.
Logic Circuit
A digital circuit that performs arithmetic functions.
Biocompatible Circuit
A printed circuit that can penetrate the skin and adapt to the biological nature of the body.
Note: Biocompatible circuits made with gold and platinum instead of copper conductors.
Printed Circuit Board; PCB
A functional board formed on an insulating substrate according to a predetermined design, comprising printed components or printed lines, and containing printed circuits.
Printed Wiring Board; PWB
A functional board formed on an insulating substrate with conductive patterns used for connections between components, excluding printed components.
Printed Board; PB
Circuit Board
A general term for printed circuit boards and printed wiring boards.
Note: Includes rigid, flexible, and rigid-flex combined single-sided, double-sided, and multilayer printed boards.
Organic Printed Board
A printed board made of insulating substrates primarily composed of polymer resin.
Inorganic Printed Board
A printed board made of insulating substrates primarily composed of inorganic materials such as ceramics or glass.
Rigid Printed Board; RPB
Rigid Board
A printed board made of rigid substrates.
Note: Includes rigid single-sided, double-sided, and multilayer printed boards.
Flexible Printed Board; FPB
Flexible Board
Flexible Printed Board, Soft Printed Board
A printed board made of flexible substrates that can be bent.
Note: Includes flexible single-sided, double-sided, and multilayer printed boards. It may have or not have non-electrical functional covering layers and reinforcement boards.
Rigid-Flex Printed Board; R-FPB
Rigid-Flex Board
Rigid-Flexible Combined Board, Soft-Hard Combined Board
A printed board that combines rigid and flexible areas with interconnected conductive patterns.
Single-Sided Printed Board; SSB
Single-Sided Board
A printed board with conductive patterns only on one side.
Double-Sided Printed Board; DSB
Double-Sided Board
A printed board with conductive patterns on both sides.
Multilayer Printed Board; MLB
Multilayer Board
A printed board with three or more conductive patterns.
One Side Two Layers Printed Board
A printed board that has another layer of circuit patterns printed on a single-sided board.
Backplane
Base Board
A printed board with discrete wiring terminals on one side and connector sockets on the other side.
Mother Board
A printed board component used to interconnect arrays of electronic modules.
Sub-Board; Daughter Board
A printed board installed on a mother board or backplane that achieves electrical connection with it.
Flush Printed Board
Flat board
A printed board where the outer surface of the conductive pattern and the outer surface of the insulating medium are on the same plane.
Metal Base Printed Board; MBPB
A printed board with a metal plate as the substrate on one side.
Metal Core Printed Board; MCPB
A printed board with a metal plate sandwiched in the inner layer.
Ceramic Printed Board
A printed board with ceramic as the insulating substrate.
High Density Interconnection Printed Board; HDIPB
HDI Board
A multilayer printed board containing micro blind holes and/or buried holes, and fine lines, made using lamination processes.
Build Up Printed Board; BUPB
A high-density printed board formed by layer stacking and multiple laminations, containing micro holes for conduction.
(See 3.2.20)
Build Up Board with Core
A high-density interconnection printed board formed by layer stacking containing a core board.
Coreless Build Up Board
No Core Board
A printed board that achieves multilayer high-density interconnection entirely by lamination.
Any Layer Micro Via HDI Board; Every Layer Interconnection HDI Board
A term for coreless build-up boards.
Substrate Like PCB; SLP
A high-density HDI board similar to IC carrier board specifications.
IC Package Carrier; IC Package Substrate
IC Carrier Board
IC Substrate
A printed board used to carry IC chips in IC packaging.
Interposer
Adapter Board
A printed board that adjusts the dimensions to achieve connection matching between IC chips and IC package carrier boards. (See Figure 3-7)
Figure 3-7: Application Diagram of Interposer
Carrier Tape
A type of tape-like film circuit board used for IC packaging.
Note: Such as lead frames with insulating film substrates or pure metal sheets in a tape form for device chip installation.
High Frequency (Microwave) Printed Board
RF/Microwave Printed Board
A printed board made from high-performance substrates to minimize signal loss for high-frequency (microwave) devices.
Note: High frequency usually refers to frequencies greater than 300MHz, and microwave refers to wavelengths less than 0.1 meters.
High Speed Printed Boards; HSPB
A printed board containing high-speed circuits.
Note: High-speed circuits refer to those where the signal propagation delay on the circuit board is greater than 1/2 the rise time of the signal driving end, causing transmission line effects in the wires.
Heavy Copper Printed Board; HCPB; Thick Copper PCB
Heavy Copper Board
A printed board containing line conductor copper thickness greater than 105μm (3oz), including single-sided, double-sided, and multilayer boards.
Embedded Component PB; Embedded Device PB; EDPB
A printed board with embedded components that can be passive or active.
Note: Active components can be chips, modules, etc., while passive components can be resistors, capacitors, inductors, etc.
Embedded Metal Block Printed Board; EMPB
A printed board with partially embedded or embedded metal blocks that aid in high heat dissipation.
Note: Metal blocks are inside the board and not visible on the surface, referred to as “embedded”; metal blocks that are deep within the board but still partially visible on the surface are referred to as “embedded”. Metal blocks usually refer to copper, aluminum, iron, etc.
Cavity Printed Board
A printed board with a cavity structure on the surface, achieving the function of recessed installation of electronic components.
Dynamic Flex Printed Board
A flexible printed board that can bend and move repeatedly after being installed in electronic devices.
Static Flex Printed Board
A flexible printed board that does not move after being bent and folded upon installation in electronic devices.
Semi Flex Printed Board
A printed board with limited bending rate, which cannot be bent repeatedly after being installed in electronic devices.
Flexible Flat Cable; FFC
A cable with two or more flat conductors arranged in parallel with fixed spacing on an insulating film plane, covered by an insulating layer except for the exposed ends of the conductors, allowing for bending and folding.
Double Access Single Sided FPB
Back Bared Single Sided FPB
A single-sided flexible printed board with exposed connection paths on both the top and bottom sides.
Sculptured Flex Printed Board
A flexible printed board with thinner conductors in bending areas, while thicker exposed connecting conductors at the edges, allowing for direct plug connections.
Polymer Thick Film Flex Printed Board; PTF-FPB
Membrane Switch
A flexible printed board formed by printing conductive polymer ink to create circuits on flexible substrates.
Note: It usually has a single-layer conductive film structure, but can also be made into double or multilayer conductive layers using insulating medium layers. Due to its wide application in keyboards or touch screens, it is referred to as a membrane switch or touch switch.
Stretchable Printed Board
A flexible printed board made from elastic substrates that can stretch and deform during use and self-recover.
Transparent Flexible Circuit Board
A flexible printed board made from transparent film substrates and nearly transparent conductive materials.
Carbon Printed Board
A printed board with a carbon film conductive pattern layer.
Silver Through-Hole Printed Board
A double-sided printed board connected by silver conductive ink through holes, forming conductive interconnections between the two sides of the substrate.
Note: The conductors on both sides of the substrate can be copper conductors or carbon film conductors.
Conductive Paste Printed Board
A printed board formed by directly screen printing or spraying conductive paste (ink) onto insulating substrates to create circuits.
Stamped Printed Board
A printed board formed by stamping metal foils to create metal circuits and adhering them to substrates.
Discrete Wiring Board
Multi-Wiring Board
Scattered Wiring Board
A printed board that achieves electrical interconnection by dispersing metal wires on insulating substrates using discrete wiring technology.
3D Printed Circuit Board; 3D PCB
Cubic Printed Board
A printed board where the insulating substrate and conductive patterns are in a three-dimensional structure, not flat. (See Figure 3-14a)
Monocoque Printed Circuit
A printed circuit made by creating circuit patterns on a thermoplastic plastic substrate and then molding it into a three-dimensional circuit board using heat and pressure molds. This is a type of three-dimensional printed board.
Vertical Conductive Structures PCB; VeCS PCB
A printed board that separates conductive grooves into conductive lines, forming vertically distributed conductive lines.
Optical-Electric Printed Circuit Board; EOPCB
A printed board that combines electrical signal transmission lines and optical signal transmission lines.
Bare Board
Light Board
An unassembled finished printed board.
Module Board
A printed board that forms a certain module function after being installed with bare chips and surface-mounted components.
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