Basic Guide to Temperature Measurement Board Production

Choosing measurement points for the temperature board should follow the principles below based on the complexity of the PCBA:

1. For one measurement point, select the BGA solder ball on the PCBA;

2. For two measurement points, select the “pins + pads” of the IC components on the PCBA;

3. For three measurement points, select the pads of SMT components with higher heat dissipation on the PCBA;

4. For four measurement points, select the pads of SMT components with lower heat dissipation on the PCBA;

5. For five measurement points, select points on the surface of the PCB.

Notes:

All thermocouple probes must not be exposed to air (hot air);

If temperature measurement at other points is required, the following methods can be used for selection and production.

Selection of temperature measurement points for BGA components

Selection of temperature measurement points for IC components

Selection of temperature measurement points for SMT components

Fix the thermocouple probe on the SMT component pad with high-temperature solder; the thermocouple probe must not be exposed to air (hot air).

Selection of temperature measurement points on the PCB surface

As shown in the figure, for selecting temperature measurement points on the PCB surface: drill a 1mm × 1/3 board thickness groove on the PCB surface, embed the thermocouple probe in the groove with red glue, and use red glue to fix the compensation wire. Do not use too much or too large red glue to avoid affecting measurement accuracy.

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Basic Guide to Temperature Measurement Board Production

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Basic Guide to Temperature Measurement Board Production

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