According to reports from Electronic Enthusiasts (by Huang Jingjing), at the 2025 elexcon Shenzhen International Electronics Show, Dongxin Semiconductor showcased a full range of storage products, including SPI NAND Flash, PPI NAND Flash, DRAM, MCP, and SPI NOR Flash, which are widely used in fields such as the Internet of Things, automotive electronics, wearables, and security monitoring.
Dongxin focuses on niche storage solutions and has built a product structure consisting of six major categories. This includes SPI NAND Flash, which offers a serial communication solution designed for single-chip integration, combining a storage array and controller on the same die, characterized by high transmission speed and reliability.
PPI NAND Flash supports industrial-grade temperatures up to 105°C and offers high reliability. SPI NOR Flash focuses on high capacity and low power consumption, supporting four instruction modes: Single/Dual/Quad SPI and QPI DTR transmission modes.
DDR3(L)/DDR4 supports low voltages of 1.5V/1.35V, with high transmission rates of 800MHz/933MHz/1066MHz. The LPDDR1/2/4X products feature core and IO voltages as low as 1.8V for LPDDR1, and VDDCANVDDQ as low as 1.2V for LPDDR2, while LPDDR4X has a VDDQ as low as 0.6V.
The MCP products integrate Flash and DDR in a low voltage design, with a core voltage of 1.8V, combining them into a single package for efficient circuit integration and improved stability.
In the automotive sector, Dongxin Semiconductor’s SLC NAND Flash, NOR Flash, and MCP products have passed AEC-Q100 validation for more part numbers, making them suitable for the stringent requirements of automotive applications. The company is actively onboarding and validating automotive clients, completing whitelist integrations with several domestic vehicle manufacturers and qualifying as a supplier for multiple Tier 1 automotive suppliers, both domestically and internationally, including well-known Tier 1 suppliers abroad.
Additionally, in the field of humanoid robotics, Dongxin Semiconductor is also developing some storage solutions. In recent years, the design of Dongxin’s small to medium capacity storage products has increasingly focused on providing customized development services based on customer needs, offering a one-stop solution from design to industrialization.
It is reported that Dongxin Semiconductor ranks among the top three in the domestic SLC NAND Flash market. Dongxin continues to strengthen its technological leadership in the SLC NAND Flash field and accelerates the iteration and upgrade of storage products. In the NAND Flash sector, its “1xnm Flash product R&D and industrialization project” has achieved mass production, with significant improvements in process optimization and product reliability metrics, and related products have entered the market sales phase. Meanwhile, the 2xnm process SLC NAND Flash product line continues to expand, with further breakthroughs in reliability metrics. Currently, in specific fields such as smart wearable devices, SLC NAND Flash has formed a substitution effect against NOR Flash in code storage applications due to its advantages in erase/write speed and storage density. This technological iteration not only reshapes the memory market landscape but also provides new technical pathways for enhancing the performance of smart terminal devices.
When discussing Dongxin’s competitive advantages, the interviewee stated that they have built a supply chain system with “local depth and global breadth.” They are expanding a dual-foundry model both domestically and internationally, capable of a fully localized supply chain, and are responsive to localized service needs.
Dongxin Semiconductor has formulated an integrated strategy of “storage, computing, and connectivity,” with storage as the core, expanding into computing and connectivity. In the Wi-Fi 7 domain, they have established a subsidiary, Yixin Tonggan, with a research and development team that possesses experience from leading international or domestic communication chip manufacturers. In the GPU field, the company has invested in Shanghai Lishuan, a chip design company dedicated to developing multi-layer (scalable) graphics rendering, which has a well-established R&D team and is synergistic with the company’s main business, helping to enhance the overall R&D strength and core competitiveness of the company, providing customers with more diverse chip solutions.
Disclaimer: This article is original from Electronic Enthusiasts, please indicate the source when reprinting. For group discussions, please add WeChat elecfans999, for submission and interview requests, please email [email protected].
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