1.PMIC（Power Management IC）: Power Management Integrated Circuit, a chip that integrates various power management functions (such as voltage regulation, boost, buck, charging, etc.) to provide stable and efficient power solutions for electronic devices, commonly found in smartphones, automotive electronics, IoT devices, etc.
2.LDO（Low Dropout Regulator）: Low Dropout Linear Regulator, a type of linear voltage regulator characterized by a small difference between input and output voltage (low dropout), which stabilizes an unstable input voltage to a fixed output voltage, suitable for scenarios with high requirements for ripple and noise (such as core power supply for chips).
3.DC-DC Converter: A direct current to direct current converter that converts input DC voltage to different output DC voltages through the switching of transistors, categorized into boost (Boost), buck (Buck), and buck-boost (Buck-Boost), with efficiency far exceeding that of LDO, suitable for high current and wide voltage range scenarios.
4.Buck Converter: A buck type DC-DC converter, its core function is to reduce “high input voltage” to “low output voltage” (e.g., from 12V to 5V), achieving energy conversion through an energy storage circuit composed of inductors, capacitors, and switches, widely used in scenarios requiring low voltage and high current power supply, such as CPUs and motors.
5.Boost Converter: A boost type DC-DC converter used to increase “low input voltage” to “high output voltage” (e.g., boosting 3.7V lithium battery voltage to 5V for powering USB devices), achieving voltage elevation through energy storage in inductors and filtering with capacitors, commonly used in charging portable devices and powering RF modules.
6.Buck-Boost Converter: A buck-boost type DC-DC converter that can flexibly convert when “input voltage is higher than or lower than output voltage” (e.g., a 3.7V lithium battery discharging from 4.2V to 3.0V while still maintaining a stable output of 3.3V), suitable for scenarios with large input voltage fluctuations (such as automotive electronics and energy storage devices).
7.Vin（Input Voltage）: Input voltage, referring to the input voltage range when the power management chip operates, is one of the core parameters for selection (e.g., a certain LDO has a Vin range of 2.5V~5.5V, which must match the front-end power supply voltage).
8.Vout（Output Voltage）: Output voltage, referring to the stable output voltage value of the power management chip, categorized into “fixed output” (e.g., 5V, 3.3V) and “adjustable output” (adjusted through external resistors), which must match the rated voltage of the load (e.g., MCU, sensors).
9.Iout（Output Current）: Output current, the maximum load current that the power management chip can continuously provide (e.g., a certain Buck converter has a maximum Iout of 2A), which must meet the maximum current demand of the load to avoid overload that could lead to chip protection or damage.
10.Dropout Voltage（Dropout Voltage）: Applicable only to LDO, referring to the minimum difference between input voltage and output voltage that the LDO maintains stable output voltage (e.g., a certain LDO has a dropout of 30mV@1A, meaning Vin must be at least 30mV higher than Vout to maintain stability), the smaller the dropout, the stronger the applicability of the LDO in low input voltage scenarios.
11.Efficiency（Efficiency）: The energy conversion efficiency of the power management chip, calculated as “(output power ÷ input power) × 100%”, the higher the efficiency, the less heat generated by the chip and the lower the energy consumption, which is a key indicator for portable devices (battery-powered) and high-power scenarios (such as automotive power supplies).
12.Ripple & Noise（Ripple and Noise）: The AC interference components in the output voltage, “ripple” is periodic fluctuation (e.g., fluctuations related to switching frequency), “noise” is random interference, both collectively referred to as “ripple noise”. The smaller this parameter, the less interference to sensitive loads (such as RF modules, analog sensors), which needs to be optimized through capacitor filtering.
13.PSRR（Power Supply Rejection Ratio）: Power Supply Rejection Ratio, measures the ability of the power management chip to “suppress the impact of input voltage fluctuations on output voltage” with units in dB, the larger the value, the stronger the suppression capability (e.g., a certain LDO has a PSRR of 60dB, meaning that when the input voltage fluctuates by 1V, the output voltage only fluctuates by 1mV), suitable for scenarios with unstable input voltage.
14.Soft Start（Soft Start）: When the power management chip is powered on, it slowly increases the output voltage (rather than reaching the rated value instantly) to avoid “inrush current” that could damage the load and the chip (such as large current surges when starting a motor), commonly found in high-power DC-DC converters and automotive power chips.
15.UVLO（Under Voltage Lockout）: Under Voltage Lockout, when the input voltage falls below a certain threshold (the UVLO threshold), the chip automatically shuts down the output to prevent abnormal operation of the chip or damage to the load due to low input voltage; when the input voltage recovers above the threshold, the chip restarts, which is a basic protection function of power chips.
16.OCP（Over Current Protection）: Over Current Protection, when the output current exceeds the rated value (the OCP threshold), the chip protects itself by limiting the current or shutting down the output to prevent load short circuits or overloads that could burn out the chip, which is one of the core safety protection functions of power management chips.
17.OTP（Over Temperature Protection）: Over Temperature Protection, when the chip temperature exceeds a safe threshold (the OTP threshold, usually between 125℃ and 150℃), the chip automatically shuts down or reduces its operation to prevent permanent damage due to high temperatures, suitable for high-temperature environments (such as automotive cabins and industrial equipment).
18.Load Regulation（Load Regulation）: The rate of change in output voltage when the output load current varies within the “minimum to maximum” range, measured in % or mV, the smaller the value, the stronger the chip’s adaptability to load changes (e.g., a certain LDO has a load regulation of ±0.5%, meaning that when the load current increases from 10mA to 1A, the output voltage fluctuation does not exceed ±0.5%).
19.Line Regulation（Line Regulation）: The rate of change in output voltage when the input voltage varies within the “minimum to maximum” range, measured in % or mV, the smaller the value, the stronger the chip’s ability to suppress input voltage fluctuations (e.g., a certain Buck converter has a line regulation of ±0.1%/V, meaning that for every 1V change in input voltage, the output voltage fluctuation does not exceed ±0.1%).
20.Quiescent Current（Quiescent Current / IQ）: The current consumed by the power management chip itself (excluding load current), usually measured in μA or nA, a key parameter for portable devices (such as Bluetooth headsets, smartwatches) — the smaller the IQ, the longer the battery standby time, low power consumption scenarios should prioritize low IQ chips.