Source: LightSense Technology Original Author: BENG This article briefly introduces several different types of chips. Different types of chips are accompanied by different node technologies. Except for logic chips, there is basically no need for technology smaller than 28nm. MEMS: Micro Electro Mechanical Systems (MEMS). Integrates industry-leading Complementary Metal-Oxide-Semiconductor (CMOS) and wafer stacking technology to … Read more
Source: Wisdom Microelectronics Original Author: Peng The reason chips are called chips is due to semiconductor technology; the biggest difference between chip systems and board-level systems is the use of semiconductor physical devices. Semiconductor devices are the foundation of chip companies. Even for chip companies or chip engineers, “semiconductor physics” is a daunting term. This … Read more
Compound semiconductors have excellent performance and a broad development prospect. Compound semiconductors mainly refer to second and third generation semiconductors such as Gallium Arsenide (GaAs), Gallium Nitride (GaN), and Silicon Carbide (SiC). Compared to the first generation of elemental semiconductors, they are significantly superior in high-frequency and high-temperature performance. Gallium Arsenide: It features high frequency, … Read more
Source: Wangcai Chip Original Author: Moshij What Is a Semiconductor? A semiconductor is a material with specific electrical properties that allows it to serve as the foundation for computers and other electronic devices. It is typically a solid chemical element or compound that conducts electricity under certain conditions but not under others. This makes it … Read more
Author Introduction Dr. Liu, Ph.D. from University of Electronic Science and Technology, an expert in microarchitecture. 1. Background The clock circuit is the most basic circuit in the chip. The performance of the clock circuit is related to whether all the modules in the SoC can achieve the expected goals, such as the main frequency … Read more
Overview In the design of high-speed analog signal chains, the layout and routing of the printed circuit board (PCB) need to consider many options, some of which are more important than others, while others depend on the application. The final answers vary, but in all cases, design engineers should consider the overall picture rather than … Read more
1、Passive Crystals——Passive crystals require an oscillator within the DSP chip, with recommended connection methods provided in the datasheet. Passive crystals do not have voltage issues; the signal level is variable, meaning it is determined by the oscillation circuit. The same crystal can be used for various voltage requirements, making it suitable for DSPs with different … Read more
1. Layout Specifications for the WiFi Module Circuit: The layout of the WiFi module should be kept away from the main control CPU and DDRAM and other high-speed digital devices to avoid mutual interference of high-frequency digital signals; The layout area of the WiFi module should include the bottom layer, avoiding the placement of other … Read more
In current microcontrollers, many older models lack Bluetooth module functionality, while new microcontrollers (MCUs) with Bluetooth modules are rarely featured in existing textbooks. Thus, after researching some materials, this article presents a method to add Bluetooth functionality to standard MCU chips, effectively addressing the integration of older microcontroller models with new technologies. 1. The Necessity … Read more
Introduction to A8105 Low Power Bluetooth Chip and Module AMICCOM’s A8105 Bluetooth Low Energy (Bluetooth LE) chip is a highly integrated Bluetooth® LE SoC. The A8105 has received BQB certification for Bluetooth Low Energy. The digital part integrates a high-performance 1T Pipeline 8051, with built-in 16K/32Kbytes Flash Memory, 2KBytes SRAM, and 24 GPIOs along with … Read more