In March of this year, ARM announced its first new chip architecture in a decade, ARMv9, claiming it offers better security, higher AI performance, and faster overall performance, which will empower 300 billion chips in the future. Recently, ARM officially unveiled three CPU and three GPU core designs based on ARMv9. The three new CPUs … Read more
In today’s smartphone application processor market, leading manufacturers MediaTek, Qualcomm, and Apple are in a three-way competition. Including the entry-level favorite UNISOC and the gradually declining Samsung Exynos, we can barely count five giants. If it weren’t for some complex external factors, Huawei’s HiSilicon should have been a dominant player here. A few years back, … Read more
A few years ago, Xiaomi entered the smartphone market with the slogan “Born for Enthusiasts,” prompting numerous manufacturers to follow suit, thus initiating a rapid development model for the domestic smartphone industry. At that time, the price point of “1999 yuan” was a common perception among consumers regarding smartphones. However, with the emergence of a … Read more
【Abstract】On April 23, Chipone Technology unveiled its next-generation 4nm AI cockpit chip X10 at the Shanghai Auto Show, accelerating the smart cockpit revolution through ecosystem building and hardware breakthroughs. The chip integrates40 TOPS NPU computing power and 154 GB/s ultra-large memory bandwidth, supporting the deployment of 7B multimodal large models on the edge, addressing response … Read more
4.4 Opening the FSP Configuration Interface If the target project is a new project, it can be compiled and run directly. However, if it is an imported project, you need to first open the FSP configuration interface to regenerate the FSP library-related code before compiling; otherwise, a compilation error will occur. The specific steps are … Read more
After the stock market closed on June 30, local time in the United States, Texas Instruments (TI), a major analog chip manufacturer, announced that it has signed an agreement with Micron Technology to acquire Micron’s 12-inch wafer fab located in Lehi, Utah, for $900 million. Upon completion of the transaction, the Lehi fab will become … Read more
Click the blue text above Follow us! Texas Instruments (TI) is making significant investments to expand capacity, supporting the ongoing development of semiconductors in the electronics field for decades to come. Texas Instruments will build six new 12-inch wafer fabrication plants to internally manufacture our diverse portfolio of analog and embedded processing semiconductor devices. These … Read more
Case IntroductionSmart Lock PCBAFunction Introduction1. Multiple Unlocking Methods Fingerprint Unlocking: Achieves fast and high-precision fingerprint recognition through capacitive or semiconductor fingerprint sensors, supporting 360° pressure from any direction. Password Unlocking: Supports touch password input and features a false password function, allowing the door to be opened even if interference codes are entered before and after … Read more
Click the blue text Follow us In the field of PCBA processing, quality and efficiency are always the core goals pursued by enterprises. However, a slight oversight in complex design and production processes can lead to production difficulties, poor product performance, and even increased rework costs. To identify and resolve potential issues during the design … Read more
He has always had a dream of architecture. Due to his passion for architectural design, during his university years, he participatedin an exchange program at the UCBERKELY School of Architecture and received a recommendation letter from Professor JAMES TATE of the School of Architecture. He also participated innine architectural competitions and projects both domestically and … Read more