MediaTek’s First 2nm Chip to Tape Out in September, Manufactured by TSMC

According to IT Home, on May 20, the Commercial Times published a blog post reporting that at the 2025 Taipei International Computer Show, MediaTek’s CEO Cai Lixing announced its first 2nm chip, which is expected to tape out in September 2025. Note from IT Home: Tape Out refers to the process of converting the designed … Read more

Analysis of Xiaomi’s Xuanjie 3nm Chip Production Compliance

First, let’s supplement whether Xiaomi’s Xuanjie 3nm chip production is compliant. This article provides a comprehensive analysis: Research on the compliance of Xiaomi’s Xuanjie 3nm chip. In summary, the new regulations for January’s bis production have ultimately landed at 30 billion transistors, mainly restricting cloud high-performance computing chips. The Xuanjie has 19 billion transistors, and … Read more

Dynamic Updates | The World’s First OPV Module Production Line Successfully Launched in Guangzhou High-tech Zone

Click the blue text to follow us Source | Guangzhou High-tech Zone Release Chasing Light Technology The World’s First Located in Huangpu District, Guangzhou High-tech Zone! Recently The World’s First 650*550 mm² Organic Photovoltaic (OPV) Module Production Line “Galaxy One” Successfully Launched! This production line was built by Chasing Light Technology, a company in Guangzhou … Read more

Comprehensive Explanation of Tape-Out: A Key Step in Chip Manufacturing

In the complex landscape of chip manufacturing, tape-out occupies a core position. As the final step in integrated circuit design, it is a critical process that transforms abstract circuit blueprints into actual chips. 1. The Connotation and Essence of Tape-Out Tape-out, expressed in English as “tape-out”, is a process that relies on a series of … Read more

What is ECO in the Wafer Tape-Out Process?

In the field of chip design, ECO (Engineering Change Order) is a key concept. Below, we will detail its definition, role, implementation process, and practical applications: 1. Definition of ECO ECO refers to a localized circuit modification plan implemented after the chip design has completed tape-out, addressing minor design defects or changes in functional requirements … Read more

A Comprehensive Summary of Flexible Circuit Board (FPC) Basics

Original contributions are welcome; the more you write, the more you earn. What is a Flexible Circuit Board (FPCB)? A Flexible Circuit Board (FPCB), commonly referred to as a soft board, is an abbreviation for Flex-PCB and is sometimes called FPC. FPCs and PCBs (Printed Circuit Boards) are similar in function and structure, but PCBs … Read more

Guide to Learning Circuit Board Technology

Guide to Learning Circuit Board Technology Overview This learning guide aims to help you review and consolidate your understanding of the circuit board technologies introduced in the source material. The source material discusses various types of Printed Circuit Boards (PCBs), their applications, key steps in the manufacturing process, and connection methods. It also covers different … Read more

Industry Insights | NPU: The Chip Revolution Driving AI Development

In recent years, with the development of artificial intelligence (AI), the Neural Processing Unit (NPU) has gradually become a focal point as an emerging computing chip technology. Compared to traditional Central Processing Units (CPUs) and Graphics Processing Units (GPUs), NPUs offer significant advantages in efficiency and low power consumption, providing new possibilities for AI application … Read more

Hexagon NPU: Designed for Low Power and High Performance AI Inference Tasks

The Hexagon NPU (Neural Processing Unit) is a dedicated hardware module designed by Qualcomm to meet the computational demands of artificial intelligence (AI). It is specifically built for low power and high performance AI inference tasks, playing a crucial role in generative AI applications on the edge (such as smartphones, PCs, and other devices). The … Read more