Opportunities from the Split of PHILIPS Semiconductor Division: NXP In 2006, PHILIPS split its semiconductor division into NXP for 7.9 billion euros. This decision was driven by Siemens’ recent split of its semiconductor division into Infineon Technologies, which yielded significant profits, prompting PHILIPS to accelerate its own split. It was also based on a precise … Read more
In April 2025, China implemented a policy imposing tariffs of up to 125% on US chips, directly targeting the Achilles’ heel of the American chip industry—manufacturing hollowing out. This move not only puts American companies in a dilemma but also unexpectedly exposes the fatal flaw in Trump’s “chip repatriation” strategy. Wafer Fabrication Target: The “Identity … Read more
About a month ago, we shared an article discussing the sharp decline in the success rate of first-time chip tape-outs, which can be referenced in the article “Chips at Historical Lows”. In response to this issue, Brian Bailey, editor of Semiconductor Engineering, stated that this is just the tip of the iceberg for chips. In … Read more
The latest semiconductor policy in China, “Place of Wafer Fabrication Equals Place of Origin,” directly changes the rules for determining the “nationality” of chips. Previously, the “nationality” of a chip could be influenced by its packaging location or the location of the design company; now it only considers the country where it is manufactured in … Read more
Semiconductor engineering editor Brian Bailey states that for chips, the success rate of first tape-outs is plummeting, and this is just the tip of the iceberg. In his view, as the success rates in the semiconductor industry decline, it may be time to reconsider our priorities. He cites statistics from the latest functional verification survey … Read more
This article is approximately 5,900 words long, recommended for saving and reading. Author | Beiwai Nanchang Produced by | Automotive Electronics and Software On April 11, 2025, the China Semiconductor Industry Association issued an official notice regarding the “Rules for the Determination of the Origin of Semiconductor Products,” clearly stating:The origin of integrated circuits will … Read more
According to search results, in addition to onsemi, CREE (Wolfspeed), Microchip, and Navitas Semiconductor, the following brands are involved in the production or foundry cooperation of silicon carbide (SiC) devices within the United States. X-FAB serves as a SiC foundry in the U.S., catering to clients in the automotive, industrial, and energy sectors. Although some … Read more
1. Reports indicate that Lenovo’s first self-developed 5nm chip has successfully taped out, aimed at tablet computers. 2. The smart car sector is accelerating the application of in-vehicle storage, with domestic EEPROMs entering the market. 3. The Ministry of Foreign Affairs responds to the U.S. plan to expand chip export restrictions to China. 4. The … Read more
Recently, the tariff war between the US and China has been intense, with both sides exchanging blows. Many people are likely more concerned about whether their stocks are crashing than the spectacle itself. I won’t delve into the timeline of the tariff war here; instead, I will focus on last Friday’s bombshell news—“the notice regarding … Read more
The China Semiconductor Industry Association has issued an “Emergency Notice on the Rules for the Recognition of the ‘Place of Origin’ of Semiconductor Products,” sparking widespread discussion. The notice states that according to the relevant regulations of the General Administration of Customs, the place of origin of “integrated circuits” is determined based on the four-digit … Read more