A Heterogeneous System-Level Package Integrating FPGA and DSP Chiplets
Follow us for more exciting discoveries! ▌This article is from Semiconductor Industry Observation Abstract: Integrating multiple heterogeneous chiplets into a package is a promising and cost-effective strategy that can build flexible and scalable systems while effectively accelerating diverse workloads. Based on this, we propose Arvon, which integrates a 14nm FPGA chiplet and two closely packed … Read more