New Opportunities for PCBs in the Era of Google TPU: The Domestic Substitution and Growth Potential of Yibo Technology!
In the wave of AI computing power iteration, PCBs (Printed Circuit Boards), as the core carrier of computing hardware, have seen their technical thresholds and market value continuously increase with the upgrade of terminal products. Looking back at the explosive cycle of NVIDIA’s AI ecosystem, Shenghong Technology achieved a 25-fold valuation leap in a year and a half due to its supply advantage in high-end PCB products; now, with the arrival of Google’s TPU (Tensor Processing Unit) V7/V8 generations, Yibo Technology, as a verified supplier of high-end PCBs to Google, is standing at a similar growth starting point. With the resonance of thick board technology, customer expansion, and capacity release, it is expected to replicate or even surpass the growth path of its predecessors.
1. Core Logic: From NVIDIA to Google, AI Giants Drive the Emergence of New PCB Leaders
The essence of AI computing power competition is the ultimate comparison of hardware performance, and PCBs, as the “connection hub” of chips, modules, and complete machines, directly determine the transmission efficiency, stability, and integration of computing devices. The previous explosion of NVIDIA’s GPU ecosystem propelled Shenghong Technology to achieve a dual explosion in performance and valuation; now, with the acceleration of the Google TPU ecosystem, new incremental opportunities are emerging for the PCB industry:
– The strategic position of Google TPU is highlighted: As the core hardware of Google’s AI computing power, TPU V7/V8 is increasingly penetrating scenarios such as large model training and cloud computing services, with its requirements for PCBs of “high bandwidth, low latency, and high reliability” far exceeding those of traditional servers, creating a differentiated competitive track for high-end PCB manufacturers;
– The binding advantage of Yibo Technology is rare: The company has verified its supply of PCB products to Google and, through an integrated service model of “PCB design + production + PCBA processing,” deeply binds customers from the design phase. As the Zhuhai board factory and fundraising projects gradually go into production, the company is expected to upgrade from “small batch customization” to “medium batch supply,” further expanding its share in Google’s supply chain while also entering the high-end supply chains of more leading technology companies.
2. Technical Barriers: The Core Competitiveness of Yibo Technology under the Trend of Thick Board Upgrades
The improvement of AI computing power is driving PCBs towards “thickening, high density, and high-speed transmission.” Currently, the thickness of PCBs required for Google TPU-related devices has reached 4-6 mm, with some high-end AT test boards even reaching 6.35 mm. This trend poses stringent requirements on the production technology and equipment configuration of PCB manufacturers:
– Core challenges in the industry are highlighted: The production of thick boards faces two key bottlenecks: first, a shortage of electroplating line equipment, which must meet the high precision requirements for uniform electroplating and impurity control of thick boards; second, the difficulty of drilling processing has increased significantly, as drilling thick boards can easily lead to rough hole walls and positional deviations, requiring extremely high precision and process control capabilities;
– Yibo Technology’s forward-looking layout: The company has proactively laid out the electroplating lines and horizontal line equipment required for thick board production, precisely matching the high material and thickness requirements of Google TPU V7/V8, with clear expectations for future imports. Compared to its peers, the company can participate in customer demand definition during the product development phase due to its “design-first” advantage, addressing technical challenges in advance and forming a closed-loop advantage of “technical research and development – customer binding – capacity landing”;
– Optimization of the competitive landscape in the industry: Currently, only a few companies in China, such as Chongda Technology, Kexiang Co., and Yibo Technology, have the capability to produce thick boards. Yibo Technology stands out in the high-end thick board field due to its binding with Google’s supply chain and integrated service model, and is expected to seize the upgrade dividends of the industry.
3. Growth Space: Capacity Release + Customer Expansion, Opening Up the Valuation Reassessment Ceiling
The growth potential of Yibo Technology not only stems from the explosion of the Google TPU ecosystem but also from the dual drive of capacity release and customer expansion:
– On the capacity side: The scale effect is gradually becoming apparent: The production of the Zhuhai board factory and fundraising projects will significantly enhance the company’s capacity scale for high-end PCBs and PCBA processing, resolving the previous bottleneck of “insufficient capacity limiting order acceptance” and promoting the company’s transformation from a “leading player in niche fields” to a “scale supplier”;
– On the customer side: From single-point breakthroughs to multi-point blossoming: The company’s customers are mainly leading technology enterprises and high-end equipment manufacturers, and a high level of stickiness is formed through the design introduction model. With the improvement of capacity and the advancement of technology validation, the company is expected to penetrate more leading customer supply chains in AI computing, cloud computing, and high-end manufacturing beyond Google, opening up market space;
– On the track side: Domestic substitution + incremental demand resonance: Currently, there is still significant room for import substitution in high-end PCBs in China, while the development of emerging fields such as AI computing, new energy vehicles, and industrial internet continues to generate incremental demand for high-end PCBs. As a domestic manufacturer with both technical barriers and customer resources, Yibo Technology is expected to achieve sustained high growth in performance driven by dual logic.
4. Core Conclusion: The PCB Leader in the Google Era, Growth Has Just Begun
From Shenghong Technology in the NVIDIA ecosystem to Yibo Technology in the Google TPU era, the computing power iteration of AI giants has always been the core growth line of the high-end PCB industry. With the triple advantages of “binding with Google + thick board technology + capacity release,” Yibo Technology has the potential to become the next high-end PCB leader:
– On the customer side, deeply binding with Google and expected to expand to more leading technology companies, with a rare position in the supply chain;
– On the technical side, forward-looking layout for thick board production, precisely matching the industry upgrade trend, building a high-barrier competitive advantage;
– On the growth side, gradually releasing capacity opens up performance growth space, with domestic substitution and incremental demand resonance driving valuation reassessment.
Currently, the company is at a critical juncture of “customer expansion + capacity release + technology landing,” and the continued explosion of the Google TPU ecosystem will become the core catalyst for performance growth. Its growth story has just begun, and it is expected to replicate or even surpass the growth path of Shenghong Technology, becoming a core investment target in the high-end PCB field of the AI era.