Agilex™ 5 FPGA and SoC and the newly launched Agilex™ 3 FPGA and SoC represent a significant leap in programmable logic technology. Both device families feature new capabilities that allow for easy migration and flexible scaling as design requirements change. They meet a wide range of industry and application needs, providing the following key advantages for next-generation designs:
Higher performance, better energy efficiency, and greater flexibility
Innovative and unique AI capabilities
Powerful future-proof security features
Diverse high-speed connectivity interfaces and transceivers
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Catering to Diverse Application Needs
The Agilex™ 3 device establishes a solid foundation for cost-effective solutions, providing strong performance for projects with lower logic density requirements. This device family features a dual-core Arm Cortex-A55 processor*, supporting LPDDR4 memory interfaces, making it ideal for applications with stringent energy efficiency and budget requirements.
Building on this, the Agilex™ 5 device extends solutions to mid-range applications by offering higher performance and a more comprehensive feature set. This device family includes a quad-core processor subsystem, featuring high-end Cortex-A76, supporting high-speed DDR5 and LPDDR5 memory interfaces, and integrates more AI tensor modules and DSP multipliers to easily tackle demanding computational challenges.
Compared to Agilex™ 3, the Agilex™ 5 device offers nearly 5 times the logic density, supports faster PCIe 4.0 interfaces, and nearly doubles logic structure performance, providing greater scalability and performance to meet more complex applications. This helps better adapt to the evolving technological demands and the stringent requirements of data-intensive complex tasks.
02
Unified Architecture, Flexible Scaling, and Increased Intelligence
The Agilex™ 3 and Agilex™ 5 devices together form a unified architecture and closely coordinated platform, enabling engineers to easily scale performance and energy efficiency. These devices are built on a common logic structure and utilize the second-generation Hyperflex™ FPGA architecture, which simplifies the development process, significantly enhances IP reusability, and accelerates time-to-market.
Both device families feature unique and innovative AI tensor modules, providing a new secure device manager (SDM) that enables more robust security features and system management, and supports MIPI D-PHY interfaces.
Thanks to this unified architecture, whether the system requires greater computing power or higher energy efficiency, the Agilex™ product line can provide more ideal solutions, continuously optimizing to meet the evolving application demands. With flexible scaling capabilities, these smarter devices can adapt to diverse industry needs and technological advancements.
03
Integrated Tensor Modules for AI Acceleration
As AI is widely applied across various vertical markets and application domains, the Agilex™ 3 and Agilex™ 5 FPGAs and SoCs provide a key feature: their logic structure integrates AI tensor modules. These dual-mode modules support DSP and tensor module operation modes, flexibly meeting diverse computational needs.
These modules can efficiently accelerate matrix-matrix and vector-matrix operations, eliminating overhead and completing dot product calculations (i.e., sum of products) within a single clock cycle, significantly enhancing performance. Additionally, these modules support various data formats, including fixed-point, INT8, FP16, FP19, FP32, BFLOAT16, and the newly added INT9 vector and complex modes, flexibly adapting to diverse AI workloads. Furthermore, the enhanced DSP modules can accurately handle traditional digital signal processing tasks, providing stronger performance for complex signal processing applications.
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Device Family Comparison Table
* Note: Estimated results are based on test designs, operating voltage, device density, and other variables; final values may be affected. Logic structure power estimates are based on the following conditions: 350 MHz, 80% utilization, 100°C. Comparisons of logic structure power and geometric mean of logic structure performance involve the following devices: Agilex™ 5 D series (A5D064A-2V), Agilex™ 5 E series (A5E065A-2V), and Agilex™ 3 C series (A3C135B-6S, logic structure power normalized to 650K LE).
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Key Markets
