Comprehensive Analysis of the High-End SoC Test Equipment Industry

Click “Follow” for free updates

Comments containing profanity will not be selected; please leave civilized comments.

1. Overview of High-End SoC Test Equipment

1.1 Definition and Functionality of High-End SoC Test Equipment

High-end SoC test equipment is a high-precision, highly complex device used for testing system-on-chip (SoC) components, which is a crucial back-end testing device in the semiconductor industry chain. These devices are primarily used for comprehensive performance validation of chips after packaging, ensuring fault-free production, and detecting manufacturing errors, timing failures, and electrical interference issues.

High-end SoC test equipment must meet the following core conditions:

1. Multi-channel parallel testing capability: Supports simultaneous testing of thousands of pins or functional modules, significantly improving testing efficiency, allowing for hundreds to thousands of pins to be tested concurrently.

1. High-frequency testing capability: Testing frequencies must cover above 800 megahertz (MHz), even reaching 10GHz levels, to meet the testing requirements of high-speed digital circuits (such as 5G communication chips and AI accelerators).

1. High precision and reliability: Ensures signal transmission integrity, avoiding signal distortion or interference at high frequencies, typically requiring testing error tolerance to be controlled within ±0.8%.

1. Flexible configuration capability: Adapts to different types of SoC chip testing requirements through the replacement of test boards or software upgrades, supporting various protocol and interface testing.

1. High throughput: Through parallel testing and fast data processing capabilities, helps semiconductor manufacturers improve production efficiency and reduce unit testing costs.

1.2 Technical Architecture and Working Principle of High-End SoC Test Equipment

The core architecture of high-end SoC test equipment mainly includes the following components:

1. Digital testing module: Responsible for processing digital signal testing of chips, including logic functions, timing characteristics, and interface protocol testing, which is the core component of SoC test equipment.

1. Analog / mixed-signal testing module: Used for testing the analog circuit parts of chips, such as power management, high-precision analog devices, and data converters, with extremely high precision requirements.

1. Test board: The most critical component of SoC test equipment, different boards are inserted based on the chip being tested, and these boards also require related supporting chips to achieve testing functionality. For frequencies below 800 MHz, conventional FPGAs are generally used, while high-end chips above 1.6G can no longer use FPGAs, and self-developed ASIC chips are used for high-end models above 800 MHz.

1. Software system: Includes test program development environment, test execution control, data collection and analysis functions, achieving automated control and optimization of the testing process.

The working principle of high-end SoC test equipment is to apply various stimulus signals to the chip under test, then collect the chip’s response signals, and compare them with the expected results to determine whether the chip is qualified. This process requires high-precision signal generation and acquisition capabilities, as well as powerful data processing and analysis capabilities.

1.3 Market Size and Development Trends of High-End SoC Test Equipment

According to market research data, the global SoC test equipment market is rapidly growing. By 2025, the global semiconductor testing equipment market is expected to reach $13.8 billion, with SoC and memory test equipment accounting for $4.8 billion and $2.4 billion, respectively. Advantest raised its global test equipment market size forecast to $6 billion in its Q2 2025 earnings report and holds an optimistic outlook for industry demand in 2026-2027.

The main driving factors for market growth include:

1. Explosion in AI chip demand: The high complexity and advanced processes of AI chips have raised the technical threshold for testing machines and packaging equipment, driving demand for high-performance testing machines.

1. Full commercialization of 5G communication: The upgrade demand for 5G base station equipment has driven the need for high-frequency, high-precision testing equipment.

1. Upgrade of automotive-grade chip testing standards: The testing precision requirements for ADAS system chips have increased from ±0.8% in 2023 to ±0.3% by 2027, driving the update of testing equipment.

1. Acceleration of edge AI applications: Low-cost models (such as DeepSeek) are accelerating the intelligence of edge devices, leading to explosive demand for smart toys, headphones, industrial terminals, etc., driving a surge in SoC testing demand.

From a technical trend perspective, high-end SoC test equipment is developing in the following directions:

1. Intelligent testing technology: By 2025, with the rapid development of artificial intelligence and machine learning technologies, intelligent testing technology will be widely applied in SoC chip testing, achieving automated control and optimization of the testing process through the introduction of intelligent testing algorithms.

1. Multi-band parallel testing: The heterogeneous integrated chips based on Chiplet design are driving testing machines towards multi-band parallel testing, with mainstream devices expected to support 32-channel synchronous testing by 2026.

1. Improvement of high-precision testing capabilities: Testing precision requirements continue to rise, with the error tolerance for high-speed interface testing expected to tighten from ±1.5% to ±0.8% by 2026, driving a 27% increase in investment in the development of optoelectronic fusion technology for testing machines.

2. Analysis of the High-End SoC Test Equipment Industry Chain

2.1 Overall Structure of the Industry Chain

The high-end SoC test equipment industry chain mainly includes upstream raw material and component suppliers, midstream test equipment manufacturers, and downstream application fields.

Upstream segment mainly includes:

• Semiconductor materials: Various chips and electronic components used to manufacture test equipment

• Test boards and core chips: Including FPGA/ASIC chips, high-precision signal processing chips, etc.

• Precision mechanical components: Such as high-precision motion control systems, probe cards, etc.

• Software and algorithms: Test program development platforms, data analysis software, etc.

Midstream segment consists of test equipment manufacturers, responsible for designing, developing, and producing various SoC testing devices, which is the core segment of the industry chain.

Downstream segment includes application fields, mainly comprising:

• AI chips: Training chips and inference chips

• 5G/6G communication chips: Baseband chips, RF front-end chips, etc.

• Automotive electronic chips: ADAS chips, in-vehicle infotainment system chips, etc.

• Consumer electronic chips: Main control chips for smartphones, tablets, wearable devices, etc.

• Industrial control chips: Industrial automation, IoT terminal devices, etc.

2.2 Upstream Supply Chain Analysis

The upstream supply chain of high-end SoC test equipment is highly specialized, involving various core technologies and key components:

1. Core chips:

• FPGA/ASIC chips: The core of the digital testing module of the testing machine, high-end models above 800 MHz use self-developed ASIC chips, while conventional FPGAs are used for models below 800 MHz.

• High-precision signal processing chips: Used for testing analog and mixed signals, with extremely high precision and stability requirements.

1. Test boards:

• They are the most critical components of SoC test equipment, different boards are inserted based on the chip being tested, and these boards also require related supporting chips to achieve testing functionality.

• High-end test boards need to integrate complex functions such as logic modules, microprocessors (MCU/CPU), digital signal processors (DSP), and embedded memory.

1. Precision mechanical components:

• High-precision probe cards: Key components connecting the testing machine with the chip under test, with increasing precision requirements as chip integration increases.

• Precision positioning systems: Ensure that the testing machine can accurately align with the test points of the chip under test, with precision requirements reaching the micrometer level.

1. Software and algorithms:

• Test program development platform: Provides an environment for writing, debugging, and optimizing test programs, supporting various testing languages and protocols.

• Data analysis software: Analyzes and processes test data, generating test reports and yield analysis results.

The main characteristics of the upstream supply chain arehigh monopoly andhigh technical barriers. Statistics show that leading Chinese testing equipment manufacturers such as Huafeng Measurement and Control and Changchuan Technology have a dependency on imported components, with American suppliers accounting for 41% and 38% of key RF modules and high-precision motion control systems, respectively. The supply disruption of these core components has led to an extension of the delivery cycle for domestic testing equipment from 90 days to 140 days in the first quarter of 2025, with some high-end SoC testing systems experiencing a 27% decrease in capacity.

2.3 Midstream Test Equipment Manufacturer Analysis

Midstream test equipment manufacturers are the core segment of the industry chain, responsible for designing, developing, and producing various SoC testing devices. Based on technical level and market positioning, they can be divided into three tiers:

First tier: International giants, including Teradyne, Advantest, etc., dominate the global high-end market.

• Teradyne: The largest semiconductor testing equipment supplier globally, with a comprehensive product line including SoC test machines, memory test machines, etc. In Q2 2025, revenue from semiconductor testing equipment reached 2.832 billion yuan, particularly strong demand for its AI-targeted SoC chip testing equipment.

• Advantest: The second-largest semiconductor testing equipment supplier globally, with increasing delivery volumes of its SoC test machines. In Q2 2025, revenue/net profit was $1.79 billion/$610 million, up 90%/278% year-on-year, continuously setting historical highs.

Second tier: Leading Chinese companies, including Huafeng Measurement and Control, Changchuan Technology, etc., have achieved breakthroughs in certain fields.

• Huafeng Measurement and Control: The domestic leader in analog testing machines, successfully launched a new generation platform STS8600 for SoC and high-end digital chip testing in 2023, expanding into the high-end SoC testing market.

• Changchuan Technology: An important player in the domestic testing machine and sorting machine field, with products such as testing machines and sorting machines recognized and used by leading integrated circuit manufacturers like Longsys Technology, Huada Semiconductor, Tongfu Microelectronics, Silan Microelectronics, and China Resources Microelectronics.

Third tier: Other domestic and foreign small and medium-sized enterprises focusing on specific niche markets.

2.4 Downstream Application Field Analysis

The downstream application fields of high-end SoC test equipment are extensive, mainly including:

1. AI chip field:

• Cloud AI chips: Used in smart computing centers and other AI chips relatively far from the user side, with computing power typically reaching over 100 TOPS, crucial for large-scale data processing and deep learning model training.

• Edge AI chips: Deployed in electronic products, vehicles, factories, and other terminal devices, with high computing efficiency, reducing reliance on cloud computing resources.

• By 2025, AI chips will account for 37% of test equipment procurement, becoming a major driver of testing machine demand growth.

1. 5G/6G communication field:

• 5G communication equipment requires support for higher data transmission rates, necessitating testing equipment with higher testing precision and faster testing speeds to meet the testing requirements for chip data transmission performance.

• 5G communication raises higher requirements for data transmission rates, latency, and reliability, necessitating more precise and efficient SoC chip testing equipment to ensure chip performance and quality.

1. Automotive electronics field:

• With the trends of electrification, intelligence, and connectivity in vehicles, the testing standards for automotive-grade SoC chips are becoming increasingly stringent, with the number of chips per vehicle increasing from 300 in traditional fuel vehicles to over 3000 in smart electric vehicles.

• The ISO 26262 functional safety certification requirements are driving testing equipment to transition towards high-reliability solutions such as fault injection analysis and environmental stress screening (ESS), with testing coverage standards increasing from 99.9% to 99.99%.

1. Consumer electronics field:

• The core SoC chips of consumer electronic products such as smartphones, tablets, and wearable devices require rigorous testing to ensure product performance and reliability.

• By 2025, global shipments of 5G smartphones are expected to exceed 1.3 billion units, directly driving a growth of over 28% in the testing demand for RF front-end modules (RF FEM) and baseband chips.

2.5 Industry Chain Scale and Growth Trends

The global SoC test equipment market continues to expand, according to the latest market data:

1. Global market size:

• By 2025, the global semiconductor testing equipment market is expected to exceed $13.8 billion, with the SoC and memory testing machine markets reaching $4.8 billion and $2.4 billion, respectively.

• By 2025, the global demand for SoC testing machines will exceed 28,000 units, with high-end testing equipment (supporting processes of 3nm and below) accounting for 35%, an increase of 14 percentage points compared to 2022.

1. Chinese market size:

• By 2025, the Chinese SoC chip testing equipment market is expected to reach 18 billion yuan, showing significant growth compared to 2020.

• The Chinese semiconductor testing equipment market size has grown from 4.55 billion yuan in 2016 to 19.45 billion yuan in 2024, with a CAGR of 19.9%, higher than the global market (CAGR of 16.2%). It is expected that by 2025, the market size of China’s semiconductor testing equipment will reach 20.89 billion yuan, with a growth rate of 7.4%.

1. Segment market structure:

• SoC testing machines are continuously increasing their market share in the AI era, reaching 60% in 2022, far exceeding 23% in 2018.

• Testing machines are the largest subcategory in semiconductor testing equipment, expected to account for 62.26% by 2024; probe stations and sorting machines have relatively smaller market shares, expected to be 20.00% and 17.74%, respectively, by 2024.

1. Regional market distribution:

• The Asia-Pacific region held a significant market share in 2017 and will continue to dominate the market. The high concentration of semiconductor manufacturers and the presence of numerous semiconductor foundries, OSATs, fabless semiconductor companies, and consumer electronics manufacturers are the main factors contributing to the Asia-Pacific region’s dominance.

• Due to the promotion of self-controllable policies in the semiconductor industry, the demand for testing equipment in the Chinese market has grown significantly, with the market size expected to reach approximately $2.5 billion by 2024, accounting for 29% of the global market, and expected to exceed $3 billion by 2025, increasing to 31%.

3. Current Development Status of the Domestic High-End SoC Test Equipment Industry

3.1 Analysis of Domestic Industrial Policy Environment

The Chinese government places great importance on the development of the semiconductor industry, especially in the context of US-China trade friction and technological blockades, implementing a series of policy measures to support the localization of semiconductor testing equipment:

1. National-level policy support:

• The “Several Policies for Promoting High-Quality Development of the Integrated Circuit Industry in the New Era” clearly states that companies developing testing equipment for advanced processes below 28 nanometers will receive tax incentives such as three exemptions and three halved tax rates, with the proportion of R&D expenses deductible increased to 150%.

• Policies jointly issued by the Ministry of Finance and other four departments provide tax incentives and financial support for testing equipment companies, encouraging increased R&D investment.

1. Industry fund support:

• The National Integrated Circuit Industry Investment Fund (Big Fund) Phase II has listed testing equipment as a key support area, investing over 8 billion yuan in leading companies like Huafeng Measurement and Control and Changchuan Technology, promoting breakthroughs in key equipment development.

• The Big Fund’s investment intensity in testing equipment companies reached 1.86 billion yuan, increasing the market share of domestic testing machines from 12% to 27%.

1. Local government supporting policies:

• 12 key integrated circuit industry bases, including Beijing, Shanghai, and Hefei, provide fixed asset investment subsidies of up to 30% for testing equipment companies.

• The Yangtze River Delta region has formed a complete collaborative system for testing machines, probe stations, and sorting machines, promoting the coordinated development of upstream and downstream enterprises in the industry chain.

1. Localization rate goals:

• The “Semiconductor Testing Equipment Technology Roadmap” formulated by the Ministry of Industry and Information Technology proposes to achieve a localization rate of over 35% for digital testing machines and RF testing machines by 2025, and over 50% for memory testing machines and system-level testing (SLT) equipment by 2030.

• By 2030, the domestic SoC testing machine industry chain is expected to form 35 globally competitive enterprises, with a localization rate of high-end testing machines exceeding 40%, driving the entire industry chain scale to exceed 50 billion yuan, and the testing service outsourcing market size reaching 18 billion yuan, increasing its global market share to 28%.

3.2 Current Status of Collaborative Innovation in the Domestic Industry Chain

Collaborative innovation in the domestic high-end SoC test equipment industry chain is gradually strengthening, but still faces some challenges:

1. Progress in upstream and downstream collaborative innovation:

• In 2023, 12 joint laboratories for testing machine chip design were established domestically, promoting the testing coverage standard from 98.5% to 99.3%.

• Companies like Changchuan Technology have established close cooperative relationships with domestic packaging and testing leaders (such as Longsys Technology, Huada Semiconductor, etc.), accelerating the verification and application of testing equipment.

1. Progress in localization of the industry chain:

• The localization procurement rate has increased from 32% in 2020 to 58% in 2023, with the stocking cycle for key components shortened to 45 days, improving efficiency by 40% compared to international supply chains.

• Shanghai Microelectronics Equipment has achieved full coverage of 28nm processes in the digital testing machine field, with its MTS3000 series testing machines receiving over 150 orders from companies like SMIC and Huahong Semiconductor.

1. Main challenges:

• Supply chain risks due to technological blockades: The continuous updates of the US export control list for semiconductor equipment have directly led to a year-on-year decline of 37% in the export volume of international testing equipment giants like ASML, Teradyne, and Advantest to China.

• Dependency on imports for core components: The dependency of leading Chinese testing equipment manufacturers like Huafeng Measurement and Control and Changchuan Technology on imported components shows that American suppliers account for 41% and 38% of key RF modules and high-precision motion control systems, respectively.

• Differentiation in technical standards: Records from the IEEE standards committee meeting in 2024 show that among the 7 new standard proposals related to testing interface protocols, 4 exhibit obvious geopolitical characteristics, leading to a 15%-20% increase in compatibility costs for multinational enterprises’ testing equipment.

3.3 Analysis of the Domestic Market Competition Landscape

The competition landscape of the domestic high-end SoC test equipment market shows a characteristic of “strong external, weak internal,” but local enterprises are accelerating their catch-up:

1. Market share distribution:

• The global SoC test machine market is mainly dominated by Teradyne and Advantest, with a combined market share exceeding 90%.

• Domestic enterprises have made certain breakthroughs in the analog/mixed testing machine field, but their market share in the high-end SoC testing machine field remains low, with a localization rate of less than 15%.

• Huafeng Measurement and Control has achieved a market share of 29.6% in the domestic analog testing machine market, an increase of 7.2 percentage points year-on-year, ranking first in the country.

1. Enterprise tier classification:

• First tier: International giants like Teradyne and Advantest dominate the high-end market.

• Second tier: Leading domestic enterprises like Huafeng Measurement and Control and Changchuan Technology have achieved breakthroughs in certain fields.

• Third tier: Other domestic and foreign small and medium-sized enterprises focusing on specific niche markets.

1. Market competition characteristics:

• Intense price competition: Domestic testing equipment has a significant price advantage, with Changchuan Technology’s D9000 series digital testing machine performing comparably to Teradyne and Advantest, but priced 30%-50% lower.

• Technical gaps still exist: In the high-end digital testing machine field, domestic equipment still lags 2-3 generations behind international leaders.

• Accelerated domestic substitution: With the improvement of domestic enterprises’ technical strength and increased policy support, the market share of domestic testing equipment is steadily increasing.

4. Analysis of Leading Domestic Enterprises in High-End SoC Testing Machines

4.1 Huafeng Measurement and Control: Domestic Leader in Analog Testing Machines Expanding into High-End SoC Testing Market

4.1.1 Company Overview and Market Position

Huafeng Measurement and Control is the absolute leader in the domestic analog testing machine field, focusing on the R&D, production, and sales of semiconductor testing equipment, with products widely used in the performance verification and quality assurance of integrated circuits such as analog, mixed-signal, power devices, and third-generation semiconductors.

• Market position: The market share of China’s analog testing machines has reached 29.6%, ranking first in the country, with a year-on-year increase of 7.2 percentage points.

• Product layout: The company’s products mainly include analog and mixed-signal testing systems, SoC testing systems, etc., with mature technology in testing analog and mixed-signal chips, high precision, and strong stability.

• Customer base: Has entered into partnerships with leading customers such as Longsys Technology, Tongfu Microelectronics, and Huawei HiSilicon, forming an industrial chain synergy effect with chip design leaders like Tsinghua Unigroup.

4.1.2 Technological Innovation and Product Breakthroughs

Huafeng Measurement and Control has achieved significant results in technological innovation, especially in the high-end SoC testing machine field:

1. High-end SoC testing machine platform STS8600:

• Comparable to Advantest’s V93000, it features 5120 digital channels and 800Mbps high-frequency testing capability, covering the multi-protocol and high-computing power testing needs of edge AI chips.

• It has entered the customer verification stage, with orders expected to contribute in 2025. The global SoC testing machine market is approximately $3.3 billion, with a localization rate of less than 15%. After the breakthrough of STS8600, it is expected to capture over 30% market share, opening up a market space worth billions.

• This platform was successfully launched in 2023, marking the company’s official entry into the high-end SoC testing machine market.

1. Core patents and technologies:

• As of February 2025, the company holds 284 patent pieces of information, achieving international advanced levels in testing precision, speed, and reliability.

• The company possesses several core patents and independent intellectual property rights, such as its developed high-precision current source technology VDS, which enables precise measurement and control of small currents, enhancing the performance of testing equipment.

• In April 2025, the company obtained an invention patent authorization for “Testing Circuit, Testing Device, and Testing Method” (patent application number CN202111313662.0), further enhancing its technological strength.

1. Breakthrough in ASIC chip autonomy:

• The company announced a convertible bond issuance plan to raise 750 million yuan, focusing on self-developed ASIC chips to address the import dependency of high-end testing machines on FPGA chips, improving testing precision and stability.

• Upon project completion, the gross margin of testing machines is expected to increase from 73% to over 75%, with net profit exceeding 40%, further enhancing the company’s profitability and market competitiveness.

4.1.3 Financial Performance and Development Prospects

Huafeng Measurement and Control has shown strong performance in recent years, with broad development prospects:

• Financial performance: In 2024, revenue is expected to reach 905 million yuan (+31%), with a net profit of 334 million yuan (+33%), and a gross margin of 73.1%, leading the industry; in Q1 2025, the order backlog is abundant, with annual revenue expected to exceed 1.2 billion yuan (+33%) and net profit reaching 450 million yuan (+35%).

• Capacity expansion: An investment of 254 million yuan is planned to build a high-end SoC testing system manufacturing center, with production capacity expected to double by 2025 to meet the expansion needs of customers like Tsinghua Unigroup.

• Global layout: Subsidiaries have been established in Japan, Malaysia, and the United States, with a global layout to hedge geopolitical risks and open up long-term growth space.

4.2 Changchuan Technology: A Pioneer in Domestic Substitution Driven by Testing Machines and Sorting Machines

4.2.1 Company Overview and Market Position

Changchuan Technology is an important enterprise in the domestic semiconductor testing equipment field, focusing on the R&D, production, and sales of integrated circuit testing equipment:

• Market position: The domestic testing machine market share is approximately 3%, higher than Huafeng Measurement and Control’s 2%, especially dominating the sorting machine field.

• Product layout: The company’s products mainly include testing machines, sorting machines, probe stations, and AOI optical inspection equipment, with testing machines accounting for 56.6% of revenue, making it the core business.

• Customer base: Products such as testing machines and sorting machines have been recognized and used by leading integrated circuit manufacturers like Longsys Technology, Huada Semiconductor, Tongfu Microelectronics, Silan Microelectronics, China Resources Microelectronics, and ASE Group.

• Global expansion: The company has successfully entered the supply chains of international customers such as Texas Instruments and Samsung, gradually expanding its global layout.

4.2.2 Technological Innovation and Product Breakthroughs

Changchuan Technology has continuously invested in technological innovation, achieving a series of important breakthroughs:

1. High-end testing machine products:

• D9000 digital testing machine: Breakthrough in 28nm process, a national first, has obtained national patents, with performance comparable to international leading levels, mainly used for high-end SoC chip testing.

• SoC testing machine: Supports high-end SoC chip testing, with performance close to international giants, achieving mass shipments, mainly applied in AI chip and automotive-grade chip testing fields.

• Memory testing machine: The company has also made progress in the memory testing machine field, with product performance continuously improving, gradually achieving domestic substitution.

1. Sorting machine technology advantages:

• The company has significant advantages in the sorting machine field, with the 9000 series (three-temperature new products) and the SUMMIT (system-level chip testing) series starting to ramp up, with market share continuously increasing.

• The company’s “three-temperature testing sorting machine” can operate stably in extreme environments from -55℃ to 200℃, with technical indicators comparable to international giants like Teradyne, successfully entering the TSMC supply chain.

1. R&D investment and innovation capability:

• From 2023 to 2024, Changchuan Technology will maintain high-intensity R&D, with R&D expense ratios remaining at 20%, focusing on high-end fields such as SoC.

• The company continuously launches new products, such as 3D-AOI equipment, which have already received bulk orders, enriching the product matrix.

4.2.3 Financial Performance and Development Prospects

Changchuan Technology has shown strong performance in recent years, with broad development prospects:

• Financial performance: In the first half of 2025, the testing machine shipment volume is expected to be approximately 12,000 units, with high-end products accounting for 40%, and global expansion supporting performance growth.

• Performance growth: In Q2 2025, the company’s revenue is expected to increase by 40% year-on-year, with net profit increasing by 50%, making it one of the best-performing segments in the semiconductor equipment sector.

• Order situation: The company has abundant orders, with a good growth momentum, especially in the AI chip testing equipment field, establishing good cooperative relationships with leading domestic AI customers.

• Capacity expansion: Based on market demand growth, the company plans to expand production by 60%-70% on the basis of 3,000 units of the 9300 system by 2025, completing capacity upgrades by the end of 2026.

4.3 Analysis of Other Key Domestic Enterprises

In addition to Huafeng Measurement and Control and Changchuan Technology, there are several other enterprises in the domestic high-end SoC testing machine field:

1. Wuhan Jinghong:

• Relying on Yangtze Memory Technologies, it has achieved mass delivery in the memory testing machine field, becoming an important enterprise in the domestic memory testing equipment sector.

• The company focuses on the R&D and production of memory testing equipment, with products mainly applied in testing DRAM, NAND, and other memory chips.

1. Jinhaitong:

• A core player in domestic AI chip sorting machines, with the 9000 series (three-temperature new products) and the SUMMIT (system-level chip testing) series starting to ramp up.

• The company has strong technical strength in the sorting machine field, with product performance continuously improving and market share gradually expanding.

1. LianDong Technology:

• The company has certain technical accumulation in the semiconductor testing equipment field, with products including testing machines and sorting machines.

• The company’s products have been verified and used by many domestic semiconductor enterprises, with gradually increasing market recognition.

1. Taitan Testing:

• Focusing on domestic high-end semiconductor testing equipment, the core team has over 10 years of experience in testing equipment R&D for leading semiconductor giants.

• The company is committed to breakthroughs in domestic high-end semiconductor testing equipment, with products achieving mass production and delivery in leading domestic IDM manufacturers and design companies.

• The equipment recently developed by the company fills the gap in the domestic market, mainly replacing foreign manufacturers for aging and testing integrated equipment for DRAM or Low Power chips.

5. Development Trends in High-End SoC Testing Machine Technology

5.1 Trends in Testing Precision and Speed Improvement

The testing precision and speed of high-end SoC testing machines are continuously improving to meet the testing needs of advanced process chips:

1. Improvement in testing precision:

• As chip processes continue to shrink, the requirements for testing precision are increasing. The testing precision requirements for ADAS system chips have increased from ±0.8% in 2023 to ±0.3% by 2027.

• High-precision, high-resolution sensors and detection technologies are continuously developing, enabling precise detection of micro-defects in SoC chips, ensuring chip quality and reliability.

1. Improvement in testing speed:

• The testing efficiency standard will increase from the current 1200 chips per hour to 1800 chips by 2028, an increase of over 50%.

• Parallel testing technology is continuously developing, with multi-site parallel testing technology achieving a leap from 64 sites to 256 sites, improving testing efficiency by 3.8 times.

1. Improvement in high-frequency testing capability:

• The testing frequency of high-end SoC testing machines is continuously increasing, from several hundred megahertz to over 10GHz, to meet the testing needs of high-speed digital circuits (such as 5G communication chips and AI accelerators).

• By 2026, the error tolerance for high-speed interface testing is expected to tighten from ±1.5% to ±0.8%, driving a 27% increase in investment in the development of optoelectronic fusion technology for testing machines.

5.2 Development Trends in Intelligent Testing Technology

Intelligent testing technology is becoming an important development direction for high-end SoC testing machines:

1. AI-driven intelligent testing:

• By 2025, with the rapid development of artificial intelligence and machine learning technologies, intelligent testing technology will be widely applied in SoC chip testing.

• By introducing intelligent testing algorithms, automated control and optimization of the testing process can be achieved, significantly improving testing efficiency and precision, with testing time reduced by over 30%.

1. Adaptive testing technology:

• AI-based adaptive testing technology will be widely applied, dynamically adjusting testing strategies based on test results to improve testing efficiency and reduce costs.

• The application coverage of artificial intelligence algorithms in the testing data analysis phase has reached 39%, reducing testing time by 28% while increasing defect detection rates to 99.9996%.

1. Big data analysis and predictive maintenance:

• Testing data management systems are fully transitioning to cloud architectures, with the market size of edge computing testing solutions exceeding $1.2 billion.

• The Testing Equipment Intelligence Index (TEII) is expected to reach 78.5 by 2030, an increase of 42 points compared to 2025, with the coverage of self-decision-making testing processes exceeding 60%.

• AI-driven predictive maintenance systems can reduce equipment downtime by 30%, with 75% of testing machines expected to have built-in self-learning diagnostic modules by 2030.

5.3 Multi-Physical Field Collaborative Testing Technology

With the increasing integration of chips and the development of heterogeneous integration technology, multi-physical field collaborative testing technology is becoming an important trend:

1. Three-dimensional testing technology:

• Three-dimensional testing technology will be further developed, enabling comprehensive testing of SoC chips to more thoroughly assess chip performance and reliability.

• For heterogeneous integrated chips based on Chiplet design, testing machines are evolving towards multi-band parallel testing, with mainstream devices expected to support 32-channel synchronous testing by 2026.

1. Multi-physical domain testing:

• With the rise of silicon carbide (SiC) and gallium nitride (GaN) power devices, as well as Chiplet heterogeneous integration technology, testing equipment needs to support multi-physical domain (electrical, thermal, mechanical) collaborative measurements.

• By 2024, devices capable of multi-dimensional testing with thermal, electrical, and mechanical capabilities are expected to occupy 60% of the high-end market, meeting the testing needs of advanced packaging and heterogeneous integrated chips.

1. Optoelectronic testing technology:

• Investment in the development of photonic chip testing equipment is growing at an annual rate of 34%, with Luxshare’s silicon photonic testing machine improving optical path calibration efficiency by 5 times.

• Prototypes of quantum chip testing systems have made breakthroughs, with Hitachi High-Tech’s low-temperature testing platform reducing the testing cycle for quantum bits to 3 hours.

5.4 Trends in Testing Equipment Intelligence and Environmental Sustainability

The intelligence and environmental sustainability of testing equipment have become important trends in industry development:

1. Intelligent testing platforms:

• The Testing Equipment Intelligence Index (TEII) is expected to reach 78.5 by 2030, an increase of 42 points compared to 2025, with the coverage of self-decision-making testing processes exceeding 60%.

• AI-driven adaptive testing is increasingly applied in the SoC testing field to improve efficiency and reduce costs.

1. Green testing technology:

• Upgraded environmental compliance requirements are driving the demand for green testing technology, with the penetration rate of energy-efficient SoC testing machines expected to reach 65% by 2029.

• The EU’s Carbon Border Adjustment Mechanism (CBAM) will promote the European market to achieve testing equipment energy efficiency standard upgrades three years ahead of schedule, incorporating carbon footprint management into industry standards.

• Using green energy in testing factory operations can reduce operating costs by 18% and carbon emission intensity by 40%, aligning with global sustainable development trends.

1. Cloud testing and remote operation and maintenance:

• The proportion of testing data uploaded to the cloud has exceeded 85%, with blockchain-based testing data certification systems achieving a penetration rate of 90% in the automotive electronics field.

• The market size of cloud testing platforms has exceeded $900 million, with Xcerra’s CloudTest solution achieving intercontinental testing resource sharing, increasing the utilization rate of high-end testing machines from 55% to 82%.

6. Development Suggestions and Observations for the High-End SoC Testing Machine Industry

6.1 Industry Development Suggestions

Based on a comprehensive analysis of the high-end SoC testing machine industry, the following development suggestions are proposed:

1. Strengthen core technology breakthroughs:

• Increase R&D investment: It is recommended that enterprises maintain high R&D investment, especially in core technology areas of high-end SoC testing machines, such as high-precision signal sources, high-speed data acquisition, and complex algorithms.

• Collaborative innovation between industry, academia, and research: Strengthen cooperation with universities and research institutions, establish joint laboratories and R&D centers to jointly tackle key technological challenges.

• Build a controllable supply chain: Promote the localization of core components to reduce supply chain risks and enhance the security of the industry chain.

1. Improve industry chain collaboration mechanisms:

• Establish industry alliances: It is recommended that leading enterprises take the lead in establishing industry alliances covering upstream and downstream enterprises to promote information sharing, technological collaboration, and resource integration.

• Strengthen collaboration at the application end: Establish close cooperative relationships with chip design, manufacturing, and packaging enterprises to jointly develop testing solutions that meet actual needs.

• Promote standard formulation: Actively participate in the formulation of international and domestic standards to enhance industry discourse power and influence.

1. Accelerate the process of domestic substitution:

• Policy support: It is recommended that the government continue to increase support for domestic testing equipment through tax incentives, R&D subsidies, and first-unit applications to promote the application and promotion of domestic equipment.

• Market guidance: Encourage domestic chip enterprises to prioritize the use of domestic testing equipment, establishing demonstration projects for domestic equipment applications to create a positive market guidance effect.

• International layout: Support domestic enterprises in “going global,” actively participating in international market competition to enhance international influence and market share.

1. Talent cultivation and introduction:

• Strengthen professional talent cultivation: It is recommended that universities add relevant majors to cultivate professionals in the semiconductor testing equipment field.

• Introduce high-end talent: Actively introduce internationally advanced talent to enhance technological innovation capabilities and management levels.

• Improve talent incentive mechanisms: Establish and improve talent incentive mechanisms to attract and retain outstanding talent, providing talent support for industry development.

6.2 Opportunity Analysis

Observations in the high-end SoC testing machine industry are mainly concentrated in the following areas:

1. Localization of high-end SoC testing machines:

• The global SoC testing machine market size is approximately $3.3 billion, with a localization rate of less than 15%. After the breakthrough of STS8600, it is expected to capture over 30% market share, opening up a market space worth billions.

• Leading domestic enterprises like Huafeng Measurement and Control and Changchuan Technology are accelerating breakthroughs in the high-end SoC testing machine field, with significant observation value.

1. AI chip testing equipment:

• AI chips will account for 37% of test equipment procurement, becoming a major driver of testing machine demand growth.

• By 2025, the global semiconductor testing equipment market is expected to exceed $13.8 billion, with the SoC and memory testing machine markets reaching $4.8 billion and $2.4 billion, respectively.

1. Automotive-grade chip testing equipment:

• The upgrade of automotive-grade chip testing standards is driving the demand for equipment iteration, especially as the testing precision requirements for ADAS system chips have increased from ±0.8% in 2023 to ±0.3% by 2027.

• The automotive electronics testing equipment market size is expected to grow at a compound annual growth rate of 24%, presenting significant observation opportunities.

1. Advanced packaging testing equipment:

• HBM high-bandwidth memory and CoWoS advanced packaging technologies are being widely adopted, driving the continuous increase in demand for front-end graphical equipment.

• Compared to traditional processes, advanced packaging has added multiple links such as PVD/CVD deposition equipment, coating and developing machines, photolithography machines, etching machines, plating machines, wafer thinning equipment, and wafer bonding equipment.

1. Intelligent testing technology:

• By 2025, with the rapid development of artificial intelligence and machine learning technologies, intelligent testing technology will be widely applied in SoC chip testing.

• The Testing Equipment Intelligence Index (TEII) is expected to reach 78.5 by 2030, an increase of 42 points compared to 2025, with the coverage of self-decision-making testing processes exceeding 60%.

6.3 Risk Warnings

Observations in the high-end SoC testing machine industry also face some risks, and observers should assess them cautiously:

1. Technological iteration risks:

• The rapid pace of semiconductor technology updates requires continuous updates to testing equipment technology, with high R&D investment and long investment return cycles.

• The high technical threshold for high-end testing machines poses significant R&D challenges, with risks of incorrect technological route selection.

1. Market competition risks:

• The global SoC testing machine market is mainly dominated by Teradyne and Advantest, with a combined market share exceeding 90%, leading to intense market competition.

• Domestic enterprises have started later in the high-end SoC testing machine field, with significant gaps in technical accumulation and market share compared to international giants.

1. Supply chain risks:

• Dependency on imports for core components: The dependency of leading Chinese testing equipment manufacturers like Huafeng Measurement and Control and Changchuan Technology on imported components shows that American suppliers account for 41% and 38% of key RF modules and high-precision motion control systems, respectively.

• International technological blockades: The continuous updates of the US export control list for semiconductor equipment have directly led to a year-on-year decline of 37% in the export volume of international testing equipment giants like ASML, Teradyne, and Advantest to China.

1. Cyclical industry risks:

• The semiconductor industry exhibits significant cyclical characteristics, with fluctuations in capital expenditure potentially leading to fluctuations in testing equipment demand.

• Changes in demand from downstream application fields may affect the demand for testing equipment, such as the development speed of AI chips and 5G communication not meeting expectations.

1. Policy change risks:

• Changes in the international trade environment: Factors such as US-China trade friction and technological blockades may impact industry development.

• Changes in domestic policy: Changes in government support policies may affect the speed and direction of industry development.

6.4 Future Development Prospects

The future development prospects of the high-end SoC testing machine industry are broad, mainly reflected in the following aspects:

1. Continuous expansion of market size:

• The global SoC testing machine market size is expected to rise from $4.86 billion in 2025 to $8.23 billion by 2030, with a compound annual growth rate of 11.2%.

• The Chinese semiconductor testing equipment market size is expected to grow from 20.89 billion yuan in 2025 to over 45 billion yuan by 2030, with a compound annual growth rate exceeding 20%.

1. Accelerated domestic substitution:

• By 2030, the domestic SoC testing machine industry chain is expected to form 35 globally competitive enterprises, with a localization rate of high-end testing machines exceeding 40%, driving the entire industry chain scale to exceed 50 billion yuan.

• Domestic enterprises are continuously improving their technical strength in the high-end SoC testing machine field, with product performance gradually approaching international leading levels, accelerating the process of domestic substitution.

1. Technological innovation driving industry upgrades:

• The development of cutting-edge technologies such as intelligent testing technology and multi-physical field collaborative testing technology will drive upgrades in the high-end SoC testing machine industry.

• The rapid development of emerging fields such as AI chips, automotive-grade chips, and advanced packaging will bring new market opportunities for high-end SoC testing machines.

1. Accelerated globalization layout:

• Domestic enterprises are accelerating their internationalization, with Huafeng Measurement and Control establishing subsidiaries in Japan, Malaysia, and the United States, with a global layout to hedge geopolitical risks.

• The export market for Chinese testing equipment is continuously expanding, with domestic equipment exports increasing by 67% in 2023, and the Southeast Asian market share rising to 32%.

7. Conclusion

High-end SoC testing machines, as key devices in the semiconductor industry chain, play a crucial role in ensuring chip performance, improving product quality, and reducing production costs. With the rapid development of emerging technologies such as 5G communication, artificial intelligence, and the Internet of Things, the application scenarios for SoC chips are continuously expanding, leading to a sustained increase in demand for testing equipment.

The global high-end SoC testing machine market is mainly dominated by international giants Teradyne and Advantest, with a combined market share exceeding 90%. Domestic enterprises have made certain breakthroughs in the analog/mixed testing machine field, but their market share in the high-end SoC testing machine field remains low, with a localization rate of less than 15%.

In recent years, supported by national policies and driven by market demand, the domestic high-end SoC testing machine industry has developed rapidly, with companies like Huafeng Measurement and Control and Changchuan Technology achieving a series of important breakthroughs in technological innovation and product development. Huafeng Measurement and Control, as the domestic leader in analog testing machines, has successfully launched a new generation platform STS8600 for SoC and high-end digital chip testing, and is investing in self-developed ASIC chip R&D through convertible bonds, expected to break through technical bottlenecks. Changchuan Technology has also made significant progress in testing machines and sorting machines, with products recognized by several leading integrated circuit manufacturers.

In the future, with the rapid development of emerging fields such as AI chips, automotive-grade chips, and advanced packaging, the demand for high-end SoC testing machines will continue to grow. Domestic enterprises should seize opportunities, strengthen core technology breakthroughs, improve industry chain collaboration mechanisms, accelerate the process of domestic substitution, and enhance international competitiveness. Investors can focus on observation opportunities in the fields of high-end SoC testing machine localization, AI chip testing equipment, and automotive-grade chip testing equipment, while being cautious of risks in technological iteration, market competition, and supply chains.

Overall, the high-end SoC testing machine industry is in a rapid development phase, with the process of domestic substitution accelerating and broad future development prospects. Domestic enterprises are expected to make important contributions to the self-controllable development of China’s semiconductor industry under the dual drive of policy support and market demand.

Warm Reminder:All prescriptions and remedies mentioned in this article are for reference and learning purposes only for professional traditional Chinese medicine practitioners and should not be used as prescriptions. Please do not blindly try medications; this platform does not bear any responsibility for any consequences arising from this!

Copyright Statement:This article is sourced from the internet. We share articles and images from the internet, and the copyright belongs to the original author and source. This article is for the purpose of learning, sharing, and disseminating more information, with no commercial use. If there are any issues regarding the content, copyright, or other matters, please contact the original author for immediate handling.