Since the 21st century, third-generation semiconductor materials represented by Gallium Nitride (GaN), Silicon Carbide (SiC), and Zinc Oxide (ZnO) have begun to emerge.However, with the continuous increase in demand for high-load computing power from 6G communication, AI smart chips, and CPUs/GPUs, complex and expensive data center cooling systems are required to maintain performance and prevent failures.Issues such as performance limitations, reduced reliability, and high cooling costs caused by insufficient heat dissipation have become common pain points in the industry.Among the known materials in nature, diamond has a thermal conductivity of up to 2000 W/m·K, which is 4 times, 13 times, and 43 times that of Silicon Carbide (SiC), Silicon (Si), and Gallium Arsenide (GaAs), respectively, and is 4-5 times higher than that of copper and silver. When the thermal conductivity requirement exceeds 500 W/m·K, diamond is currently the only available heat sink material.As a newcomer in the semiconductor industry, I have always had a question that I couldn’t clarify.From the perspective of thermal conductivity, diamond is indeed impeccable. However, from a production standpoint, the current synthetic diamonds are mainly produced through High-Temperature High-Pressure (HTHP) and Microwave Plasma Chemical Vapor Deposition (MPCVD) methods. The former cannot produce large-sized single crystals, while the latter has a long growth cycle for large-sized single crystals, high processing losses, and exorbitant costs (the market price for a 3-inch polycrystalline diamond can reach 30,000 RMB, and those over 8 inches can exceed hundreds of thousands). In terms of market acceptance, if it is not a pure necessity, the promotional value of this material is really of little practical significance.Even if companies rapidly enhance the overall performance of their equipment in the coming time, indirectly reducing production costs, there is still a long way to go compared to Gallium Nitride (GaN) and Silicon Carbide (SiC).However, from a technological perspective, the market’s demand for heat dissipation is inevitable.So, is there any other way to quickly reduce costs, or to use other materials as a compromise (diamond-copper, aluminum, and other composite materials are also not very suitable)?Welcome everyone to exchange and discuss!END