BEOL

Chip Manufacturing: FEOL, MEOL, and BEOL (Part 2)

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Chip Manufacturing: FEOL, MEOL, and BEOL (Part 2)

The front-end of line (FEOL), middle-end of line (MEOL), and back-end of line (BEOL) processes in chip manufacturing form a highly coordinated technological chain. These three stages precisely interact through physical structures, material interfaces, and electrical characteristics, ultimately determining the three core metrics of chip performance: Power, Performance, and Area (PPA). The front-end defines the … Read more

Chip Manufacturing: FEOL, MEOL, and BEOL

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Chip Manufacturing: FEOL, MEOL, and BEOL

Front-End (FEOL), Middle-End (MEOL), and Back-End (BEOL) are the three main stages in the semiconductor manufacturing process, each playing a different role in the manufacturing process. The Front-End (FEOL) primarily focuses on the fabrication of transistors; the Middle-End (MEOL) emphasizes the connection of transistors with metal interconnects, serving to…