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As circuit and system design sizes shrink, it becomes increasingly challenging for engineers to select suitable components for their designs. In many different applications (such as earbuds, thermometers, wearable devices, styluses, portable sensors) and other space-critical applications, you need to purchase a component that meets your requirements and allows for the addition of more functionality without increasing the size of the circuit board.
To address this challenge, Texas Instruments (TI) has introduced the MSPM0C110x series, featuring an ultra-compact microcontroller (MCU) with 8 pins (for the WSON-DSG package), measuring just 2mm x 2mm. The MSPM0C MCU is based on a 32-bit Arm® Cortex®-M0+ core and offers highly integrated peripherals, low power modes, and small package sizes.
More Possibilities: Size
Texas Instruments (TI) has invested in optimizing packaging products to provide flexible options that help you create more efficient designs. For example, the WSON package of the MSPM0C is 7.35 times smaller than the common 8-pin SOIC package.
Figure 1: Size comparison between SOIC and WSON
The MSPM0C110x features an 8-pin WSON package that includes up to 6 I/Os, allowing engineers to seamlessly connect various sensors, actuators, and peripherals, making it an ideal choice for a variety of applications. With the optimized I/Os of the MSPM0C110x, designers can innovate without being constrained by interface limitations.
For instance, when designing a stylish stylus, engineers can select a compact MCU tailored for limited PCB sizes. The compact size of the MCU ensures efficient use of limited board space. In addition to overall size, the MSPM0C MCU also features a high-precision internal oscillator, eliminating the need for an external crystal. The Z-height of the MSP WSON 8-pin package is only 0.8mm, significantly less than the height of the SOIC 8-pin package (nearly 2mm). These factors collectively facilitate low-cost, space-sensitive designs.
More Possibilities: Features
This product series is easy to use and can be introduced into systems as power monitors, timer controllers, I/O expanders, auxiliary control functions, sensor readers, protocol transmission tools, etc. These options are unrestricted.
Despite its compact form, the MSPM0C110x does not compromise on functionality. The MSPM0C110x devices are based on an enhanced Arm® Cortex®-M0+ core platform, operating at frequencies up to 24MHz, providing up to 16KB of embedded flash memory and 1KB of SRAM. This small device boasts many advanced features that can provide advantages for various use cases.
Table 1: Models of MSPM0C110x devices in WSON package
In many applications such as electric toothbrushes and shavers, ADCs are essential. This compact 2mm x 2mm MCU no longer uses discrete component designs that occupy board space but instead employs an integrated 12-bit 1.5Msps ADC to accurately monitor the system’s battery power voltage, thus not limiting functionality.
More Possibilities: Pin-to-Pin Compatibility
The MSPM0C110x series is also pin-to-pin compatible with other devices and competitive devices. Designers can use our simple migration tools to port application code from existing code to the MSP platform by copying and pasting header files and converting basic peripherals. This hardware and software compatibility can accelerate your development speed and shorten development time.
Conclusion
These MCUs may be very small, but they offer -40°C to 125°C rated operating temperatures, ensuring robust performance in any environment. You can start using our devices and evaluate our LaunchPad on TI.com to achieve your small-size, low-cost designs. As we enter a new era defined by high space utilization devices, the MSPM0C110x is committed to helping engineers create smaller, smarter products.
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