Click👇 to follow, set as a star in the upper right menu··· “Due to the 250-gram weight limit, every gram of the drone’s body must be meticulously calculated, but I ultimately completed this challenge.” On June 13, Xu Yang, a junior student from the Chinese University of Hong Kong (Shenzhen), shared with a reporter from … Read more
NXP Semiconductors announced on the 13th that it will collaborate with Rimac Technology, a supplier specializing in high-performance control systems, to develop a centralized vehicle architecture for Software-Defined Vehicles (SDV).The solution developed by the two companies is based on NXP’s S32E2 processor, which is part of NXP’s S32 automotive processing platform. The S32E2 is a … Read more
Starting from Android 9, the WiFi concurrency feature has been supported, with the following official description: Android 9 introduces a feature that allows devices to operate in both STA and AP modes simultaneously. For devices that support Dual Band Simultaneous (DBS), this feature enables new functionalities, such as not interrupting the STA WLAN when the … Read more
China and the U.S. Trade: The Darling of the Era On September 14, 2020, late at night, Hsinchu, Taiwan. TSMC’s factory was brightly lit, and the machines on the production line were still running at high speed, but there was an unusual tension in the air. Just a few hours earlier, the U.S. Department of … Read more
Gathering semiconductor industry news, technical frontiers, and development trends! According to a report from Kuai Technology on June 2, the semiconductor industry is currently facing a severe technical “winter,” with the chip tape-out success rate dropping to a historic low, posing significant challenges to industry development. Data released by Siemens, a giant in the Electronic … Read more
[Image][Image][Image] On June 2nd, Chip Ranking reported that the success rate of chip tape-outs has dropped to a historical low! According to Siemens EDA data, the success rate of first-time design finalization (Tape-out) has fallen to 14%, a significant decrease from 24% two years ago. Eight out of ten companies experienced failures in their first … Read more
PCEC Technical Article As an option to reduce the spacing requirements for conductive components, when the pollution level is controlled to level 2 or lower, the spacing and component isolation of printed circuit boards with ‘ic’ protection level assembly can use the reduced spacing shown in Table 1 under the following conditions. That is, if … Read more
Technical Article Technical Articles PCECDuring the review of technical materials, it was found that there are some misconceptions regarding the evaluation of temperature classes for printed lines on Class I and Class II circuit boards. Additionally, some requirements in GB/T 3836.4—2021 “Explosive Atmospheres Part 4: Equipment Protected by Intrinsic Safety ‘i’” were not clearly stated, … Read more
Guide to the Manufacturing Methods of Printed Circuit Boards 1. Overview This article discusses the methods for surface treating copper foil, carrier-attached copper foil, and their use in manufacturing copper-clad laminates and printed circuit boards. The patent primarily focuses on how to optimize the adhesion of plated circuits, etchability of electroless copper, and dry film … Read more
