IGBT with Built-in Fast Recovery Diode (FRD) IGBT product lineup includes types with built-in fast recovery diodes (hereinafter referred to as “FRD”). In inverter and motor drive applications using IGBT, the diode is also used as a path for the reverse current generated during switching. This diode is known as a “freewheeling diode,” and is … Read more
Gobi Jia is laying out glass substrates, and nano-microcrystalline glass has entered the terminal supply chain Microcrystalline glass: Source:Gobi Jia On June 12, during the 2025 online collective reception day for investors of listed companies in Hubei, the person in charge of Gobi Jia stated that the company’s glass substrate and carrier board business has … Read more
When missiles pierce the sky, radars scan vast distances, and warships cut through waves, the “power source” of these steel beasts is the seemingly unremarkable yet crucial power semiconductor devices. Harsh Military Environments: Commercial Devices Struggle Extreme Temperatures: The surface of missiles reaches extremely high temperatures when crossing the atmosphere, while polar equipment faces -50℃ … Read more
Semiconductor Investment Market Update for the Fourth Week of June 1. Yitang Co., Ltd.: Two core products rank second globally in market share, with technology reaching international leading levels. 2. Domestic chips receive timely capital support. 3. Ximi Technology secures Series B funding. 4. Another financing of 3.1 billion yuan is needed; previous fundraising projects … Read more
01 Market Dynamics and Industry Trends U.S. Department of Commerce / Synopsys / Cadence: Lifted export restrictions on chip design software to China, allowing Synopsys, Cadence, and Siemens to resume sales to China, resulting in a surge in related stock prices and a net inflow of 21.585 billion yuan into the electronics sector. This move … Read more
The semiconductor manufacturing process can be divided into front-end and back-end processes. The front-end process mainly involves wafer manufacturing, while the back-end process primarily focuses on packaging and testing. Among these, packaging (Package) in the back-end process refers to a series of technical methods that connect tested integrated circuit bare chips (Die) to external circuits, … Read more
What are the common software engineering methods in embedded development? Follow UsLearn Embedded Together, learn and grow together 1. Object-Oriented Programming (OOP) Although C is not an object-oriented programming language, with some programming techniques, it can achieve the core features of Object-Oriented Programming (OOP), such as encapsulation, inheritance, and polymorphism. 1. Encapsulation Encapsulation is the … Read more
Scan to FollowLearn Embedded Together, learn and grow together Introduction PlatformIO is a cross-platform embedded development toolchain that supports over 50 development platforms and more than 2000 development boards. Official resource link (copy to browser to open): https://docs.platformio.org/en/latest/what-is-platformio.html It integrates features such as a build system, library management, debugging tools, and continuous integration, providing embedded … Read more
Height: 158 cm, Weight: 47.3 kg, BMI: 18.9. This morning, I wore my nice little tank top and went out for a run, feeling refreshed! My weight fluctuated by 1 kg before and after running 8 kilometers! It’s really hard to lose weight 😄. I really love this marathon tank top; it has excellent breathability. … Read more
Multiple Choice Questions 51-100 51.When operating under conditions without shadow obstruction, with solar irradiance above( ) and wind speed not exceeding( ), the temperature difference on the surface of the same photovoltaic module (the area directly above the cells) should be less than( ). Photovoltaic power plants with a capacity greater than 50 kWp should … Read more