The demand for high-speed interconnects in data centers and AI applications is increasing, leading to the replacement of 800Gbps optical modules with 1.6Tbps optical modules in the latest data centers. Recently, Zhongji Xuchuang announced that its 1.6Tbps optical module products have passed customer certification and are expected to gradually ramp up production starting in 2025.NVIDIA has adopted the 1.6T optical module in its GB200 NVL 72 network architecture, which has already begun small-scale shipments, with expectations for significant volume shipments after the second quarter of 2025. The GB300, released at this year’s NVIDIA GTC conference, also heavily incorporates the 1.6T optical module, making it an essential component in future high-end AI data centers.Currently, major optical module manufacturers in the industry have launched 1.6T products. At the China Optical Expo last September, companies such as HiSilicon, Solstice Optoelectronics, Huagong Zhengyuan, Hisense Broadband, Guangxun Technology, and LianTe Technology showcased related products.ST recently introduced a new generation of proprietary silicon photonics technology and a new generation of BiCMOS technology, enabling customers to design next-generation optical interconnect products and manufacture them through ST’s wafer fabs, providing optical interconnect solutions of 800Gbps/1.6Tbps for cloud service operators.Recently, Guangxun Technology also announced that it will demonstrate a new generation of low-power 1.6T OSFP224 DR8 optical module, utilizing a 3nm process DSP chip, which significantly reduces module power consumption compared to the 5nm solution.The optical module mainly includes core components such as silicon photonic chips, DSPs, and SerDes chips. The silicon photonic chip is used for transmitting and receiving optical signals; the DSP chip is responsible for converting and processing signals between optical and electrical formats, which is key to achieving high-speed transmission in 1.6T optical modules. Some DSP chips also integrate CDR and SerDes functions to optimize system latency and power consumption; SerDes, or serializer/deserializer, converts parallel data into high-speed serial signals, allowing for multi-channel aggregation such as 16×100G to achieve 1.6T in the 1.6T optical module.Thus, the DSP is central to achieving high-speed, long-distance transmission in optical modules, and its technological iteration directly impacts the performance and cost of optical communication systems. For 1.6T optical modules, ultra-high bandwidth requires DSP support for more complex modulation formats, such as PAM4 and QPSK. Additionally, the high-density integration and low power consumption of DSPs are also critical, determining the size, power consumption, and heat generation of the optical module.With the demand for high integration, low power consumption, and high performance, DSPs are also beginning to adopt advanced processes. In December last year, Marvell launched the industry’s first 3nm process PAM4 optical DSP chip, Ara, built on Marvell’s sixth-generation technology in the PAM4 optical DSP field. It can integrate eight 200 Gbps electrical channels and eight 200 Gbps optical channels, achieving a transmission rate of 1.6 Tbps in a compact standardized module.Ara leverages Marvell’s comprehensive 3nm platform and integrates 200 Gbps SerDes and optical modulator drivers, reducing the power consumption of the 1.6 Tbps optical module by over 20%. By utilizing 3nm technology and laser driver integration, Ara can simplify module design complexity, power consumption, and cost, establishing a new benchmark for next-generation AI and cloud infrastructure.Broadcom also launched a 200 Gbps PAM-4 DSP physical layer interface product, Sian2, last September. Sian2 uses a 5nm process, supports 200G/channel, and can support a 1.6T transceiver with power consumption below 28W; it supports pluggable modules for 800G and 1.6T, meeting diverse application needs; it supports data rates of 212.5 Gb/s and 226.875 Gb/s, suitable for InfiniBand and Ethernet applications. NewEase and Zhongji Xuchuang previously used Broadcom’s Sian2 DSP solution to create a 1.6T pluggable optical module.In summary, the core chip technology of 1.6T optical modules focuses on silicon photonic integration, high-speed signal processing, and low-power design. The DSP is central to achieving high-speed, long-distance transmission in optical modules, and its technological iteration directly impacts the performance and cost of optical communication systems. In the future, with the development of silicon photonic integration and CPO technology, in addition to using more advanced processes, DSPs may further integrate with optical chips to promote more compact and efficient solutions.
Disclaimer: This article is compiled from reports by Electronic Enthusiasts. Please cite the source above when reprinting. For group discussions, please add WeChat elecfans999,for submission of interview requests, please send an email to [email protected].
More Hot Articles to Read
-
Announcing NVIDIA’s Most Powerful Chip! Blackwell Ultra, Rubin Chip Unveiled, New Robot Takes Center Stage
-
Breaking News! Huada Jiutian Plans to Acquire Chip and Domestic Semiconductor Merger Wave Begins
-
Is HBM No Longer the Main Battlefield? 256TB, QLC, Enterprise-Level… Flash Memory Shakes AI Storage
-
3·15 Evening Show Exposed! Home Appliance Platforms “Unnecessary Repairs for Minor Issues”; AI Used in Black Market…
-
Automotive-Grade RISC-V MCU Ignites Market! Leading Companies Enter, Market Accelerates Reshuffle
Click to Follow and Star Us
Set us as a star to not miss any updates!