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Air bubbles generated during PCBA soldering, commonly referred to as voids, typically occur during the reflow soldering and wave soldering processes in PCBA manufacturing. So, how can we prevent air bubbles during PCBA soldering?
1. Baking
Bake PCBs and components that have been exposed to air for an extended period to prevent moisture.
2. Control of Solder Paste
Solder paste containing moisture can easily lead to air bubbles and solder balls. First, choose high-quality solder paste, strictly follow the procedures for rewarming and stirring the solder paste, and minimize the time the solder paste is exposed to air. After printing the solder paste, it should be promptly subjected to reflow soldering.
3. Control of Workshop Humidity
Systematically monitor the humidity in the workshop, keeping it between 40-60%.
4. Set a Reasonable Temperature Profile
Test the furnace temperature twice a day to optimize the temperature profile, ensuring that the heating rate is not too fast.
5. Flux Spraying
During wave soldering, the amount of flux sprayed should not be excessive and should be applied reasonably.
6. Optimize the Temperature Profile
The temperature in the preheating zone must meet the requirements and should not be too low, allowing the flux to fully evaporate, and the speed through the furnace should not be too fast.
There are many factors that can affect air bubbles in PCBA soldering, which can be analyzed from aspects such as PCB design, PCB humidity, furnace temperature, flux (spray size), chain speed, solder wave height, and solder composition. It may take multiple adjustments to achieve a better process.
Shenzhen Yingchuangli Electronics Co., Ltd. was established in 2005. The company has its own SMT factory and has invested in a PCB factory, specializing in circuit board production, component procurement, SMT processing, and assembly testing as a one-stop service. It positions itself as a “professional, fast, multi-variety, small-batch one-stop EMS service provider.” The company is equipped with high-precision imported equipment, fully automatic multifunctional pick-and-place machines, reflow soldering, wave soldering, selective wave soldering, X-Ray inspection machines, AOI equipment, etc. Products have passed UL safety certification, ISO9001 international quality system certification, IATF16949 international automotive electronics quality system certification, and military industry certification for weaponry and equipment. Products cover multiple fields including automotive electronics, medical devices, industrial control, aerospace, and communication equipment.
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