Microdot Solder Paste Technology: Reconstructing Manufacturing Paradigms for Chip Integration and Stacking Design
Introduction: A Manufacturing Revolution from “Millimeter” to “Micrometer” Scale As Moore’s Law approaches its physical limits, the main battleground for increasing chip integration has shifted from wafer processing to advanced packaging. The rise of System-in-Package (SiP), 3D stacking, and heterogeneous integration technologies presents unprecedented challenges for micrometer-level interconnection processes. Traditional stencil printing is limited by … Read more
