Chip Integration Articles

Contents of Integrated Circuits and Embedded Systems, Issue 9, 2025

2026-05-13 by boardor

Integrated Circuits and Embedded Systems, 2025Issue 9 is out now! Featured Article Application and Key Challenges of Glass Core Substrates for Chip Integration Chen Changhao, Xu Shimen, Lin Pengrong Research Papers Development Research on Asynchronous Circuit Chips for High-Performance Computing Wen Li, Zhang Yueyang, Zhang Shenghai Real-Time Optimization Research of FreeModbus Protocol Stack DMA Driver … Read more

Job Analysis: SoC System Design

2026-01-19 by boardor

SoC Design Organizational Structure 1. SoC Architecture Design Department SoC Architect/Manager: Leads the chip system architecture design (including computation/storage/bus architecture, low-power strategies), responsible for competitive analysis and technical roadmap formulation.. System Design Engineer: Translates architecture into microarchitecture design, defines module interfaces and PPA targets.. 2. Front-end Design Department IP Integration Engineer: Responsible for bus design … Read more

A Decade of Domestic Smartphones: The Turning Point for Self-Developed Chips

2026-01-06 by boardor

Image Source｜Visual China Last year, OPPO recruited 2000 people to work on chips and launched its first self-developed NPU chip. In May of this year, OPPO made further moves by introducing the imaging-specific chip Mariana X into the mid-range Reno8 series. While it may seem like OPPO is over-engineering, industry insiders have a different perspective: … Read more

Microdot Solder Paste Technology: Reconstructing Manufacturing Paradigms for Chip Integration and Stacking Design

2025-11-04 by boardor

Introduction: A Manufacturing Revolution from “Millimeter” to “Micrometer” Scale As Moore’s Law approaches its physical limits, the main battleground for increasing chip integration has shifted from wafer processing to advanced packaging. The rise of System-in-Package (SiP), 3D stacking, and heterogeneous integration technologies presents unprecedented challenges for micrometer-level interconnection processes. Traditional stencil printing is limited by … Read more

Analysis of Trends in Smart Cockpit SoC Chip Applications

2025-07-02 by boardor

Author | Chen Kangcheng Produced by | Yanzhi Auto With the continuous development of automobile intelligence, the level of intelligence in the cockpit is also increasing. The cockpit has evolved from the initial mechanical cockpit to the electronic cockpit, and now to the smart cockpit. For users, the display and interaction inside the cockpit have … Read more