Tape-out refers to the delivery of the final design data to the foundry for initial production, which is the most milestone-significant and also the most “costly” phase in the chip design process. 1. Decisions and Verification Before Tape-Out 1. MPW Full Name: Multi-Project Wafer Chinese: 多项目晶圆 Explanation: A method to reduce tape-out costs. It involves … Read more
Linux Virtual Server (DR) Logical Architecture Component Introduction The DR mode (Direct Routing) of LVS (Linux Virtual Server) is a high-performance load balancing method characterized by the following: • Director: Responsible for modifying the destination MAC address of the client request packets to the Real Server MAC address, and then directly forwarding them to the … Read more
Click the Blue Words Follow Us #03 Detailed Explanation of Chip Tape-Out Technology 3.1 Design Check and Layout Verification Before proceeding with chip tape-out, design checks and layout verification are essential steps that are crucial for ensuring the success of the tape-out. Design Rule Check (DRC):The main purpose of this process is to thoroughly review … Read more
Source: EETOP Blog Author: mervin_li Link: https://blog.eetop.cn/1582944 As we all know, chip projects are complex system engineering tasks, where each link can significantly impact the final delivery. From experience, good project management includes important aspects such as resource allocation, risk assessment, process control, and delivery acceptance. How can these points be achieved independently yet cohesively? … Read more