Tape-out refers to the delivery of the final design data to the foundry for initial production, which is the most milestone-significant and also the most “costly” phase in the chip design process. 1. Decisions and Verification Before Tape-Out 1. MPW Full Name: Multi-Project Wafer Chinese: 多项目晶圆 Explanation: A method to reduce tape-out costs. It involves … Read more
As digital IC engineers, we all know that the tape-out process in chip design is both an exciting and stressful phase — the tape-out itself. Today, let’s discuss the two main options available during tape-out:MPW and Full Mask. This is not just a technical choice, but a strategic decision. What are the differences between these … Read more
NEWS Photo: Academician Wu Hanming from the Chinese Academy of Engineering delivers a speech at the opening of the course. Recently, the School of Integrated Circuits at Zhejiang University, in collaboration with the Zhejiang Integrated Circuit Innovation Platform, successfully held the Mini MPW tape-out demonstration course. This demonstration course focused on three directions: analog, digital, … Read more