Core Case Analysis Technology of PCBA
1. Soldering of PoP 1.2 Process Methods The production mainly adopts the on-board stacking process, which has two methods: 1) Solder paste method; 2) Solder paste method. The core of the process: The process of applying flux or solder paste. 1.3 Common Soldering Defects 1) Open solder/ball pit 1) Bridging 1.4 Mechanism and Causes of … Read more