Hangshun Achieves 1mm² MCU with 3D Heterogeneous Integration!
At the Shenzhen International Electronics Show and Embedded Exhibition that opened this week, the local MCU company “Hangshun” showcased the mass-produced1mm² M0 core HK32F005 chip, which is even smaller thanTexas Instruments (TI)’s so-called“world’s smallest MCU” released in June this year, which has a size of 1.38mm². This ultra-small MCU has shocked many industry players! How … Read more