Dongfeng Automotive’s Automotive-grade MCU Chip DF30 Completes First Tape-out Verification
This article is brought to you by Semiconductor Industry Review Recently, Zhang Fanwu, the Chief Engineer of Intelligent Technology at Dongfeng Motor’s Global Innovation Center, announced that Dongfeng’s automotive-grade high-performance MCU chip DF30 has completed its first tape-out (trial production) verification, and automotive-grade validation will begin shortly, with mass production planned for next year. The … Read more
