Horizon Deepens Cooperation with Volkswagen Group; Dongfeng’s Automotive-grade MCU Chip Successfully Taped Out for the First Time

Horizon Deepens Cooperation with Volkswagen Group; Dongfeng's Automotive-grade MCU Chip Successfully Taped Out for the First Time

Horizon Deepens Cooperation with Volkswagen Group On April 7, Horizon and Volkswagen Group officially announced further cooperation in the high-end sector based on Horizon’s full-scene intelligent driving solution HSD (Horizon SuperDriveā„¢). It is reported that this cooperation will see HSD serve as an important technological support for Volkswagen Group’s “In China, For China” strategy for … Read more

Dongfeng Automotive’s Automotive-grade MCU Chip DF30 Completes First Tape-out Verification

Dongfeng Automotive's Automotive-grade MCU Chip DF30 Completes First Tape-out Verification

This article is brought to you by Semiconductor Industry Review Recently, Zhang Fanwu, the Chief Engineer of Intelligent Technology at Dongfeng Motor’s Global Innovation Center, announced that Dongfeng’s automotive-grade high-performance MCU chip DF30 has completed its first tape-out (trial production) verification, and automotive-grade validation will begin shortly, with mass production planned for next year. The … Read more