AMD’s New EPYC Processor Completes Tape-Out, Utilizing TSMC’s 2nm Process

AMD's New EPYC Processor Completes Tape-Out, Utilizing TSMC's 2nm Process

On April 14 local time, AMD announced that its next-generation Zen 6 EPYC processor “Venice” has officially completed tape-out, becoming the industry’s first high-performance computing (HPC) processor to utilize TSMC’s 2nm (N2) process technology. AMD stated that this marks a significant breakthrough in the collaboration between AMD and TSMC on advanced process technology, demonstrating both … Read more

Milestone! The World’s First 2nm HPC Processor Completes Tape-Out and Successfully Powers On!

Milestone! The World's First 2nm HPC Processor Completes Tape-Out and Successfully Powers On!

AMD announced late Monday that it has achieved its first 2nm chip, which is the core complex die of its 6th generation EPYC “Venice” processor (core complex die (CPU)), and this processor is expected to launch next year. The “Venice” core complex die is the industry’s first high-performance computing (HPC) central processing unit design that … Read more

AMD Announces Zen 6 EPYC ‘Venice’ as the First HPC Chip to Tape Out and Enter Production on TSMC’s N2 Process

AMD Announces Zen 6 EPYC 'Venice' as the First HPC Chip to Tape Out and Enter Production on TSMC's N2 Process

This article is reprinted from: IT HomeAuthor: Su Bo On the 14th local time, AMD announced that its next-generation (Zen 6) EPYC processor, codenamed ‘Venice’, has become the first HPC (High-Performance Computing) chip to tape out and enter production on TSMC’s 2nm N2 process node. The EPYC ‘Venice’ processor is expected to be launched next … Read more

Linux 6.13 Drama: Microsoft’s Code Changes Cause Chaos, Intel and AMD Rush to Fix

Linux 6.13 Drama: Microsoft's Code Changes Cause Chaos, Intel and AMD Rush to Fix

Originally published on CSDN (ID: CSDNnews) Compiled by Su Ma Recently, the Linux development team announced that they have successfully completed the development of the Linux kernel version 6.13 rc7, and barring any unforeseen circumstances, the final stable version will be officially released next week. As a key figure in Linux, Linus Torvalds also mentioned … Read more

Major Developments in the Chip Industry: US Chip Giants Collaborate with China, AMD Shows Interest – What Signals Are Being Sent?

Major Developments in the Chip Industry: US Chip Giants Collaborate with China, AMD Shows Interest - What Signals Are Being Sent?

Significant news continues to emerge in the chip sector. First, the latest actions by US chip giant Intel have drawn attention. On August 2, according to a report by the South China Morning Post cited by Reference News, Intel is collaborating with Shenzhen to establish a new chip innovation center to deepen relations. On the … Read more

Lisa Su’s Journey: From Chip Queen to AI Leader

Lisa Su's Journey: From Chip Queen to AI Leader

Lisa Su’s Journey of AI Transformation: A Glamorous Transition from Chip Queen to AI Leader In the rapidly changing semiconductor industry, Lisa Su is undoubtedly a highly influential female leader. She has led AMD out of difficulties and reshaped its glory, earning the title of “Chip Queen.” Now, with keen insight and forward-looking strategic vision, … Read more

PC Chip Landscape Shifts: AMD Completes 2nm Chip Taping Out, Intel Faces Two Major Dilemmas

PC Chip Landscape Shifts: AMD Completes 2nm Chip Taping Out, Intel Faces Two Major Dilemmas

When you feel challenged, think of Intel! On April 14, 2025, at TSMC’s headquarters in Hsinchu, AMD CEO Dr. Lisa Su and TSMC Chairman Dr. C.C. Wei held a wafer the size of a fingernail, announcing a groundbreaking news in the industry—the world’s first 2nm high-performance computing chip, Zen6 EPYC Venice, has completed its tape-out. … Read more

AMD’s New 2nm EPYC Processor Completes Tape-Out; TSMC Plans to Mass Produce Advanced Panel-Level Packaging by 2027; Five US Companies Sue Trump Administration

AMD's New 2nm EPYC Processor Completes Tape-Out; TSMC Plans to Mass Produce Advanced Panel-Level Packaging by 2027; Five US Companies Sue Trump Administration

1. AMD’s new EPYC processor completes tape-out using TSMC’s 2nm process 2. TSMC plans to mass produce advanced panel-level packaging by 2027 3. Apple to analyze user data from devices to enhance AI technology 4. Reports indicate Taiwanese bidders are competing for AMD’s ZT server assets 5. Five US companies jointly sue the Trump administration … Read more

AMD EPYC Embedded 9005 Series Processors: High-Performance Solutions Tailored for the Embedded Market

AMD EPYC Embedded 9005 Series Processors: High-Performance Solutions Tailored for the Embedded Market

Recently, at the Embedded World Conference in Nuremberg, Germany, AMD (Advanced Micro Devices) officially launched its fifth-generation EPYC embedded processor—the AMD EPYC Embedded 9005 series, codenamed “Embedded Turin.” This product is based on AMD’s latest “Zen 5” architecture, optimized for embedded applications, and aims to meet the growing computational demands in networking, storage, and industrial … Read more

How Powerful is AMD’s Fifth Generation EPYC Embedded Processor with Zen 5 Architecture?

How Powerful is AMD's Fifth Generation EPYC Embedded Processor with Zen 5 Architecture?

The embedded computing market is currently undergoing significant transformation, driven by an explosion in AI-driven network traffic, a surge in data, and an expanding demand for industrial edge computing power. Traditional embedded processors are facing unprecedented challenges in performance and reliability. Recently, at the Embedded World 2025 conference, AMD launched its AMD EPYC Embedded 9005 … Read more