On April 14 local time, AMD announced that its next-generation Zen 6 EPYC processor “Venice” has officially completed tape-out, becoming the industry’s first high-performance computing (HPC) processor to utilize TSMC’s 2nm (N2) process technology. AMD stated that this marks a significant breakthrough in the collaboration between AMD and TSMC on advanced process technology, demonstrating both … Read more
Recently, Jiaxing Dazhe Optoelectronics announced that its R&D team has successfully fabricated a large-area 1×2 m perovskite film. Dazhe Optoelectronics has overcome the challenges of large-area perovskite film preparation through its independently developed vapor-assisted crystallization control technology, dynamic gradient film formation process, and cross-scale defect regulation technology, successfully producing high-quality films at the 1×2 meter … Read more
On April 27, 2025, Dazhe Photovoltaics announced that its R&D teamsuccessfully fabricated a large-area perovskite thin film measuring 1×2 m. Dazhe Photovoltaics has overcome the challenges of large-area perovskite thin film preparation through its self-developed vapor-assisted crystallization control technology, dynamic gradient film formation process, and cross-scale defect regulation technology, successfully producing high-quality thin films at … Read more
First Company: Beidou XingtongSubfield: Satellite Navigation, 5G Ceramic Components, Automotive Intelligent NetworkingBeidou Relevance: As a leading enterprise in the entire Beidou navigation industry chain, Beidou Xingtong covers chips, modules, terminals, and system applications.Company Highlights: Beidou Xingtong is the first listed company in China’s satellite navigation industry, with main businesses including the research and development of … Read more
The China Semiconductor Industry Association announced an important policy adjustment on April 11, 2025, changing the certification standard for the origin of integrated circuits from “packaging location” to “wafer fabrication location.” This new regulation is expected to accelerate the migration of global chip companies’ wafer fabrication processes to mainland China, bringing a significant influx of … Read more
May. Click the blue text to follow us 2025.05 About a month ago, we shared an article discussing the sharp decline in the success rate of chip tape-outs. For more details, refer to the article titled “Chips, Historical Low Points”. In response to this issue, Brian Bailey, editor of Semiconductor Engineering, stated that this is … Read more
About a month ago, the Semiconductor Industry Observer WeChat account shared an article discussing the sharp decline in the success rate of first-time chip tape-outs. For more details, refer to the article titled “Chips at a Historical Low”. In response to this issue, Brian Bailey, editor of Semiconductor Engineering, stated that this is just the … Read more
Case IntroductionSmart Bracelet PCBAFunction Overview1. Health Monitoring Features Heart Rate Monitoring: Real-time detection of the user’s heart rate changes through built-in optical or capacitive sensors, providing heart rate data, heart rate zones, and alerts. Sleep Monitoring: Analyzes the user’s sleep patterns, including deep sleep, light sleep, and awake time, providing sleep quality assessments and improvement … Read more
To alleviate the inventory pressure caused by returns of electronic products, Du and Wang devised a scheme to deliberately damage product circuit boards by applying high current, burning out components, and then claiming “quality issues” to exchange for new products, thereby committing fraud. Recently, the Haidian Court sentenced defendants Du and Wang to three years … Read more
Key Technical Field: This involves the field of electronic products, particularly the design and manufacturing technology of rigid-flex circuit boards. Overview of Background Technology: With the continuous development of consumer electronic products, the requirements for circuit boards are becoming increasingly high, including aspects such aslightweight, easy assembly, signal transmission speed, and product reliability. The rigid-flex … Read more