China’s Urgent Announcement! Chip Wafer Production Location Recognized as Origin – What Impact on Intel, AMD, and Qualcomm?

The China Semiconductor Industry Association has issued an “Emergency Notice on the Rules for the Recognition of the ‘Origin’ of Semiconductor Products,” sparking widespread discussion. The notice states that according to the relevant regulations of the General Administration of Customs,the origin of “integrated circuits” is determined based on the four-digit tariff number change principle,meaning the … Read more

What Percentage of Chips Succeed on the First Tape-Out?

The integrated circuit design field is facing a severe reality. Only about 20% of ASIC chips succeed on their first tape-out. A significant reason for the high failure rate is that the challenges brought by new process nodes have not been fully understood. While some long-standing issues have been integrated into design tools and processes, … Read more

Non-AI Semiconductor Surge! (Countermeasures for Wafer Fabrication)

Last night, U.S. stocks plummeted, leading to a triple whammy for stocks, currencies, and bonds.The crisis involving the U.S. dollar and bonds is actually unrelated to the A-shares.However, it is necessary to mention that:If there are any insiders on the other side, they should be aware that the pitfalls of U.S. bonds are currently significant, … Read more

Comprehensive Explanation of Tape-Out: A Key Process in Chip Manufacturing

In the complex landscape of chip manufacturing, tape-out occupies a core position. As the final step in integrated circuit design, it is a crucial process that transforms abstract circuit blueprints into actual chips. 1. The Connotation and Essence of Tape-Out Tape-out, expressed in English as “tape-out”, is a process that relies on a series of … Read more

Semiconductors: Wafer Fabrication Location Recognized as Place of Origin

Yesterday the China Semiconductor Industry Association issued a notice regarding the “Rules for the Recognition of the ‘Place of Origin’ of Semiconductor Products,” which suggests: “For ‘integrated circuits,’ whether packaged or unpackaged, the place of origin declared during import customs clearance should be based on the location of the ‘wafer fabrication factory.’” This news has … Read more

Clarification of the Semiconductor ‘Wafer Fabrication Location Equals Origin’ Rule

The China Semiconductor Industry Association issued a document to its member units on April 11, emphasizing the customs declaration principles regarding the origin of imported chips.According to the relevant regulations of the General Administration of Customs, the origin of “integrated circuits” is determined based on the four-digit tariff number change principle, meaning the wafer fabrication … Read more

Interpretation of the New Regulations on the Location of Wafer Tape-Out Factories

On April 11, Friday, the China Semiconductor Industry Association released the “Notice on the Rules for Determining the “Country of Origin” of Semiconductor Products,” which is as follows: Official Account: Notice from the China Semiconductor Industry Association on the Rules for Determining the “Country of Origin” of Semiconductor Products This article interprets the certification of … Read more

Why the First Silicon Tape-Out Success Rate for Chips Has Significantly Decreased

(This article is translated from Semiconductor Engineering) As the complexity of chips continues to increase, chip manufacturers are shifting from single-chip designs to multi-chip components, requiring more iterations, and the increasing level of customization makes design and verification work more time-consuming. Consequently, the first silicon tape-out success rate is sharply declining. Details from a new … Read more

PC Chip Landscape Shifts: AMD Completes 2nm Chip Taping Out, Intel Faces Two Major Dilemmas

When you feel challenged, think of Intel! On April 14, 2025, at TSMC’s headquarters in Hsinchu, AMD CEO Dr. Lisa Su and TSMC Chairman Dr. C.C. Wei held a wafer the size of a fingernail, announcing a groundbreaking news in the industry—the world’s first 2nm high-performance computing chip, Zen6 EPYC Venice, has completed its tape-out. … Read more

The Global Chip Industry Faces an ‘ID Revolution’: New Rules for Wafer Origin Certification Reshape the Industry Landscape

Rule Rewrite: The Battle for a Chip’s ‘Birth Certificate’ The new origin rules released by the China Semiconductor Industry Association on April 11 are like a deep-water bomb dropped into a calm lake—integrated circuit origin certification is shifting from ‘label tracing’ to ‘wafer origin certification’. This seemingly technical adjustment is triggering an ‘ID revolution’ in … Read more