Embedded Hardware

 

  • System on Modules (SoM)
  • Single Board Computers (SBC)
  • Development Boards
  • Industrial PCs & Embedded Computers
  • IoT & Edge Computing Gateways
  • AI & Machine Learning Modules
  • Rugged & Industrial-Grade Components
  • Peripherals & Expansion Modules (Displays, Sensors, Power Modules)

Microchannel Liquid Cooling Plates for AI Chips (3)

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Microchannel Liquid Cooling Plates for AI Chips (1) Microchannel Liquid Cooling Plates for AI Chips (2) A clear trend is that as the thermal flux density of chips increases, thermal management is evolving into a platform-wide, systemic challenge. I believe that in all advanced chip companies and server enterprises, the thermal management department will rapidly … Read more

The Tactile Revolution: Pashini Perception Equips Robots with ‘Digital Skin’

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At the 2025 World Robot Conference, a humanoid robot gently pinches an egg, with fingertip sensors capturing subtle force changes of 0.01N—just the right amount of pressure, leaving the eggshell intact. This seemingly simple action represents a revolution in robotic perception capabilities. In the thriving era of embodied intelligence in 2025, Pashini Perception Technology (Shenzhen) … Read more

Why Do Chip Substrates Prefer the Crystal Orientation?

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In chip manufacturing, the “substrate” not only determines the physical foundation of the wafer but also profoundly affects the electrical performance, reliability, yield, and process compatibility of the devices. But have you noticed? The vast majority of CMOS chips use <100> crystal-oriented silicon substrates. Why does almost the entire industry “favor” the <100> orientation? Today, … Read more

AI Ignites Chip Revolution, Capitalizing on New Opportunities in Advanced Packaging

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Selected community article series “AI Ignites Chip Revolution, Capitalizing on New Opportunities in Advanced Packaging” Original Author:Shu Shu, Original Link: https://www.24krmb.com/thread-4322-1-1.html Hello everyone, today I want to discuss a particularly hot topic—the new opportunities in chip packaging brought about by AI. It can be said that the demand for intelligent computing is surging, and the … Read more

Beyond Machines: The Gentle Disruption of Xiaopeng Robotics

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When we think of robots, we often instinctively associate them with cold metal shells and rigid mechanical joints, as if “rationality” and “coldness” are inherent labels. However, the emergence of Xiaopeng Robotics has completely shattered this preconceived notion, bringing a tangible warmth to technology for the first time. It is not merely a simple assembly … Read more

Does Huawei’s NPU Have Dedicated Modules for Reinforcement Learning or Transformers?

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Your question is very critical! Indeed, Huawei’s Ascend series chips are based on NPU (Neural Processing Unit) architecture, which is fundamentally different from general-purpose accelerators like NVIDIA GPUs. However, it does not mean that it cannot perform high-end training; rather, there are differences in technical routes, ecosystem maturity, and absolute computing power. The following is … Read more

Video: Decoding the New ‘Vision’ of 1536-Partition High-Resolution dToF Sensors

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Specializing in distance and depth measurement, the time-of-flight sensor dToF, has surprisingly also focused on resolution?! 3×3 partitions, hazy; 8×8 partitions, vaguely visible; It must be the ams OSRAM TMF8829, with 48×32 partitions, the three-dimensional ‘vision’ is clearer! From the ams OSRAM WeChat official account

Xingjingcheng Sensors Break Foreign Monopoly as a Rising ‘Little Giant’ in Honggang Street

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In the Dayun AI Town of Honggang Street, Longgang District, Shenzhen, a national-level specialized and innovative ‘little giant’ enterprise is quietly changing the landscape of China’s sensor industry. Shenzhen Xingjingcheng Technology Co., Ltd. (hereinafter referred to as ‘Xingjingcheng’) was established in 2009 and is a national high-tech enterprise focused on the research and production of … Read more