Comprehensive Guide to Electronic Manufacturing Processes (Download Massive Resources for Free) (Click the above blue text to access learning materials!) The new generation of Kirin has more than one model in action!Just over a month after the launch of Kirin 9020, we are now welcoming the Kirin 8000A.Let’s take a look at what Huawei’s second … Read more
The packaging is compact and neat, and the built-in antennas have these advantages. The effect picture of the XDR3250 looks very much like an ashtray, but the actual product does not resemble it much, as it looks more like a fruit plate. Opening the outer packaging: All accessories: Power output specification is 12V/2A. A super … Read more
Our laptops hide a secret blueprint inside, which specifies the instruction set that the computer can execute and serves as an interface between hardware and software. These instructions are hidden behind proprietary technology and cannot be altered. However, starting from 2025, users may be able to purchase a new type of laptop with an open … Read more
As the “nerve center” connecting various electronic systems in vehicles, automotive communication chips must ensure high-speed transmission of massive data while guaranteeing zero-latency processing of critical information, laying the foundation for a safe and efficient intelligent driving experience. Editor / Rongge In the wave of automotive intelligence and connectivity, automotive communication chips have become the … Read more
Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards Abstract This guide aims to help you review and consolidate your understanding of Flexible Printed Circuit Boards (FPCB), Chip on Film (COF) modules, and their manufacturing methods. The main content covers the components of flexible circuit boards, the characteristics of bent and non-bent areas, … Read more
2. Technical Field Pengding is involved in Flexible Circuit Boards (FPCB), Chip-on-Film (COF) modules, and electronic devices that include flexible circuit boards, particularly flexible printed circuit boards used for COF in various electronic devices. 3. Background Technical Issues As electronic products trend towards thinner, smaller, and lighter designs, there is a need for high-density installation … Read more
Chapter Review and Key Points Invention Title (Page 4, [0008]): Pengding involves printed circuit boards, power receiving modules, battery units, and power communication modules. Understanding these four components constitutes the main content of Pengding. Technical Field (Page 4, [0001]): The application field of Pengding is understood to be printed circuit boards, power receiving modules, battery … Read more
First Public Disclosure of Water-Damaged Vehicle Circuit Board Disassembly: 85% of Hidden Hazards Can Be Fatal Submerged for 10 minutes, hazards can linger for 3 years. This is the shocking data we obtained from the first disassembly of a water-damaged vehicle circuit board. While most people focus on the visible issues of water-damaged vehicles, the … Read more
Overview This research guide aims to help you review and understand the knowledge related to wearable flexible printed circuit boards (hereinafter referred to as wearable FPCBs), their manufacturing methods, and their applications in smart devices. The core content revolves around a novel wearable FPCB described in the patent document and its technical characteristics. Core Concepts … Read more
Core Content Overview: This patent discloses a printed circuit board, power receiving module, battery unit, and power receiving communication module. The core innovation lies in optimizing the layout and connection methods of coils between different layers of the printed circuit board, particularly by introducing a design that incorporates vias in the crossover areas to reduce … Read more