Core Content Overview: This patent discloses a printed circuit board, power receiving module, battery unit, and power receiving communication module. The core innovation lies in optimizing the layout and connection methods of coils between different layers of the printed circuit board, particularly by introducing a design that incorporates vias in the crossover areas to reduce parasitic capacitance and parasitic resistance, thereby effectively suppressing the increase of impedance components in the power receiving module across a wide frequency band, improving wireless power transfer efficiency, and reducing manufacturing costs.
Main Technical Issues and Solutions:
- Issue: In wireless power systems, the size of the receiving coil needs to be larger to improve efficiency. However, with larger coils, the parasitic capacitance and parasitic resistance between the layers of the printed circuit board significantly increase with frequency, leading to an increase in the impedance components of the power receiving module, which reduces wireless power efficiency.
- Solution: A multilayer printed circuit board structure is adopted, and vias are introduced in the crossover areas of the coils on different layers. By connecting parts of the coils from one layer to another through the insulating layer in the crossover areas, the current path is altered, effectively reducing the parasitic capacitance and parasitic resistance generated in the crossover areas.
Key Technical Details and Innovations:
- Multilayer Coil Structure: The patent describes a printed circuit board that includes at least two layers of coils (first coil part and second coil part, which may also include a third coil part, etc.), with these coils formed on different insulating layers.
- Via Connections in Crossover Areas: In the crossover areas of the first coil part and the second coil part (or more layers of coils), vias are set up for connections. These vias can connect the cut portions of the coils to the coils on another layer or extend the ends of the coils to the outside through vias.
- For example, claim 1 describes that “the first coil part is cut at each crossover area, and the cut portion and another portion are connected through the vias in each crossover area, extending to the outside of the first insulating layer, forming lead-out parts on the first insulating layer, which are configured to pass through between the cut portion and another portion of the first coil part in each crossover area, with the lead-out part having a width larger than that of the first coil part at the inner end, and the second terminal being electrically connected to the lead-out part outside the first area.” (Claim 1, Page 2)
- Claims 2, 3, and 4 further describe the number of vias (3, 4, 6) and the connection methods between different layers.
- Optimized Coil Shapes and Layouts: The patent describes that coils can take on shapes such as spiral or circular, and the coils on different layers can be aligned or offset in layout. By optimizing the layout and via positions, parasitic effects can be further reduced.
- Impact on Power Receiving Module Impedance: The patent experimentally verifies that this structure can effectively suppress the increase of impedance components in the power receiving module. Figures 7, 8, 13, and 14 show the relationship between the impedance of different coil structures and frequency, as well as a block diagram of the wireless power system.
- “Therefore, it can suppress the increase of resistance components across a wide frequency band, and the connection operations with other electronic devices are easy.” (Specification 0039, Page 7)
- “Another aspect of the present invention is to provide a power receiving module that can operate with minimal power loss across a wide frequency band.” (Specification 0040, Page 7)
- Power Receiving Communication Module: The patent also discloses a power receiving communication module that can receive wireless communication signals based on the above printed circuit board through electromagnetic induction or magnetic field resonance.
Important Experimental Data and Results:
- Figure 7 shows the relationship between the impedance and frequency of two coil samples (s1 and s2). Sample s1 uses the structure of the present invention, while sample s2 uses a conventional structure. The results show that the increase in impedance components of sample s1 is less than that of sample s2 as frequency increases.
- Figure 8 shows the temperature changes of samples with different coil thicknesses at different frequencies. The results indicate that the coils using the structure of the present invention have a smaller increase in temperature under the same conditions, indicating lower energy loss.
- Detailed experimental data describe significant improvements in impedance values and temperature changes across different frequency ranges when comparing samples using the structure of the present invention (e.g., s11-s15, s21-s25) with samples using conventional structures.
Application Fields: This technology can be widely applied in various wireless power and wireless communication devices, especially those requiring efficient energy transmission.
Conclusion: The contribution of Pengding lies in effectively reducing the impact of parasitic capacitance and parasitic resistance on the performance of the power receiving module at high frequencies by setting vias in the crossover areas of multilayer printed circuit board coils, thereby improving wireless power efficiency and providing a technical foundation for achieving more compact and efficient wireless power solutions. This technology enhances performance and reduces manufacturing costs through optimized circuit board structures.
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