MCE-LR83
Loongson SeriesCOMe Core Board
(Product Front View Image)

(Product Back View Image)
Product Overview
The MCE-LR83 project is a domestically controllable, fully domestic COM-Express module that adheres to the PICMG COM.0 R2.1 standard, with pin definitions compatible with COM Express Type 6. The module’s processor is based on the Loongson LS3A5000 quad-core processor, with a maximum frequency of 2.5GHz (standard configuration at 2.3GHz), compatible with the Loongson LS3A4000 processor, and equipped with the Loongson self-developed bridge chip 7A2000, which integrates 3D GPU display functionality. Inter-chip communication uses the HT3.0 high-speed bus, and it comes standard with 8GB DDR4 memory and 64GB SSD onboard.
This motherboard provides a rich set of interface resources, including commonly used interfaces such as PCIe, SATA, USB, UART, DVI, and VGA. The module dimensions are 95*95mm, designed for high shock resistance, fully surface-mounted, and modular design, featuring high performance, high localization, high stability, and high reliability, making it widely applicable in government, scientific research, medical, power, communication, and transportation fields.
Product Features
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Wide voltage supply: 8V~14V;
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Fully domestic production rate;
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Onboard domestic Loongson 3A5000 processor, with an option for Loongson 3A4000 processor;
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Onboard 8GB memory, dual-channel design;
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Rich interface resources, wide applicability;
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Onboard integrated 7A2000 display;
Parameter Summary
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Item |
Specification |
Specification Description |
|
Processor Platform |
Processor |
Loongson 3A5000 processor (optional Loongson 3A4000 processor) |
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Bridge Chip |
Loongson 7A2000 |
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Memory |
Onboard 8GB DDR4 |
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Firmware |
Onboard 16MB SPI FLASH |
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Storage |
Onboard 64GB SSD (optional SATA3) |
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System |
Domestic operating systems such as Loongnix, Kirin, etc. |
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|
COM-E Interface |
Ethernet |
2 GE ports, supporting 10/100/1000M adaptive |
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PCI-E |
PCIE_G0: 2 PCI-E 3.0 x8 (optional 1 PCI-E 3.0 x16) PCIE_F1: 1 PCI-E 3.0 x4 (optional 2 PCI-E 3.0 x1) PCIE_F0: 4 PCI-E 2.0 x1 (optional 1 PCI-E 2.0 x4) |
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SATA |
4 SATA 3.0 ports (SATA3 and SSD optional) |
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USB |
4 USB 3.0 ports 4 USB 2.0 ports |
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I2C |
2 I2C ports |
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UART |
4 LVTTL UART ports (can be reused as 4 CAN ports) |
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GPIO |
4 GPI, 4 GPO |
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Audio |
1 HDA |
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Display |
2 HDMI |
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1 VGA (mirrored display with HDMI0 interface) |
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Power |
Power On |
Supports AT, ATX modes; |
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Input Voltage |
DC12V ±10% |
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Power Consumption |
≤60W |
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Structure |
Dimensions |
Compact Modules: 95mm x 95mm |
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Interface Type |
PICMG COM.0 R2.1 Type6 |
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Localization Rate |
Material Types |
100% |
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Material Types |
100% |
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Environment Requirements |
Operating Temperature |
-5℃ to 55℃ (optional: -40 to 65℃) |
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Storage Temperature |
-40℃ to 70℃ |
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|
Humidity |
5 to 95% RH, non-condensing |

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