Guide to Multilayer Circuit Board Manufacturing

Guide to Multilayer Circuit Board Manufacturing Technology

Learning Objectives

This guide aims to help you review and understand the methods of multilayer circuit board manufacturing and the resulting circuit boards. It focuses on the following aspects:

• Core Technology: Understand the core innovations of this patent, which is a method that simplifies the multilayer circuit board manufacturing process and improves reliability.
• Manufacturing Steps: Master the key steps in the multilayer circuit board manufacturing process as detailed in the document.
• Circuit Board Structure: Understand the layered structure and components of the multilayer circuit boards produced by this method.
• Hole Formation and Connection: Learn about the roles of different types of holes (blind holes, through holes) in this manufacturing method and how to achieve conductive connections.
• Material Applications: Recognize the main types of materials used in the manufacturing process.
• Advantages and Effects: Understand the advantages brought by this method compared to existing technologies, such as simplified processes, reduced costs, and improved reliability.

Key Concept Review

• Multilayer Circuit Board (Multilayer circuit board)
• Substrate Layer (Substrate layer)
• Copper Foil Layer (Copper foil layer)
• Conductive Layer (Conductive layer)
• Insulating Layer (Insulating layer)
• Blind Hole (Blind hole)
• Through Hole (Through hole)
• Hole Filling (Hole filling)
• Conductive Hole (Conductive hole)
• Lamination (Lamination)
• Patterning (Patterning)
• Electroplating (Electroplating)
• Solder Mask Layer (Solder mask layer)

Quiz

Please answer the following questions in 2-3 sentences:

1. What type of electronic component manufacturing method does this patent primarily involve?
2. According to the patent description, what are the two most basic components that a multilayer circuit board must contain?
3. How are the first conductive layer and the second conductive layer formed in this manufacturing method?
4. What roles do blind holes and through holes play in multilayer circuit boards?
5. What materials are used in the filling step of this patent to achieve conductive connections?
6. What are the main improvements in the process of this manufacturing method compared to existing technologies?
7. How is the connection between inner layer circuits achieved in multilayer circuit boards manufactured using this method?
8. What methods for forming blind holes are mentioned in the patent?
9. What impact does the manufacturing method described in this patent have on the cost of multilayer circuit boards?
10. How does this method improve the reliability of multilayer circuit boards?

Quiz Answers

1. This patent primarily involves the manufacturing method of multilayer circuit boards.
2. According to the patent description, a multilayer circuit board must contain at least one substrate layer and the first and second copper foil layers located on opposite surfaces of the substrate layer.
3. The first copper foil layer is made to form the first conductive layer, and the second copper foil layer is made to form the second conductive layer.
4. Blind holes and through holes are mainly used to connect the conductive layers between different layers, forming conductive pathways.
5. The filling step in this patent uses conductive paste to achieve conductive connections.
6. This method simplifies the steps for achieving conductivity between inner layer circuits by first making the inner layers and then laminating and filling holes, thus reducing the process.
7. In multilayer circuit boards manufactured using this method, the connection between inner layer circuits is achieved through conductive paste filled in blind holes or through holes.
8. The methods for forming blind holes mentioned in the patent include drilling and filling.
9. Multilayer circuit boards manufactured using this method can reduce costs due to the simplified manufacturing process.
10. This method improves reliability by using filling to achieve connections between inner layer circuits, avoiding misalignment and short-circuiting between layers.

Paper Format Issues

Please choose one of the questions and write a paper on the patent technology. No answers are required.

1. Analyze how the multilayer circuit board manufacturing method described in this patent simplifies processes and reduces costs, and compare it with existing technologies.
2. Discuss the impact of the formation and filling processes of blind holes and through holes on the electrical performance and reliability of multilayer circuit boards in this patent technology.
3. Analyze the structure and components of the multilayer circuit board described in this patent and discuss how different material choices affect circuit board performance.
4. Evaluate the application prospects and potential challenges of this patent technology in the manufacturing of future high-density, high-integration electronic products.
5. Compare the technical characteristics, application scope, and manufacturing costs of this patent with other multilayer circuit board manufacturing methods.

Glossary

• Multilayer Circuit Board: A circuit board made of two or more conductive layers and insulating layers laminated together, used to connect electronic components.
• Substrate Layer: The basic support layer of the circuit board, usually made of insulating material.
• Copper Foil Layer: Copper foil laid on the substrate layer to form conductive traces.
• Conductive Layer: The traces on the circuit board formed by copper foil or other conductive materials through patterning.
• Insulating Layer: The material layer located between conductive layers that serves as insulation.
• Blind Hole: A hole that connects the outer layer and inner conductive layers of the circuit board but does not penetrate the entire board.
• Through Hole: A hole that penetrates the entire circuit board, connecting all conductive layers.
• Hole Filling: The process of filling blind holes or through holes with conductive or insulating materials.
• Conductive Hole: A hole that can achieve conductive connections after filling or copper plating treatments.
• Lamination: The process of pressing different material layers together under high temperature and pressure to form a multilayer structure.
• Patterning: The process of forming the desired circuit pattern on the conductive layer through photolithography, etching, etc.
• Electroplating: The process of depositing a metal layer, such as copper, on the substrate or hole walls through electrochemical methods.
• Solder Mask Layer: An insulating layer covering the surface of the circuit board to protect traces and prevent solder short circuits.

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