Hot News
Xiaomi 17 Smartphone Officially Released
On September 25, the Xiaomi 17 smartphone was officially launched, claiming to be “the most powerful compact flagship in Xiaomi’s history.” The Xiaomi 17 is the first globally to feature Qualcomm’s fifth-generation Snapdragon 8 Supreme processor, equipped with a stereo annular cold pump cooling system (three times the performance of traditional VC), claiming to outperform the iPhone 17 in cooling capabilities.
The Xiaomi 17’s screen supports a peak brightness of 3500 nits and utilizes a new generation of M10 screen lighting technology, with the luminous efficiency of the new red light-emitting material improved by 11.4%, achieving international leadership in domestic light-emitting materials for the first time.
The Xiaomi 17 is also equipped with a 7000mAh battery, officially tested to last 12.2 hours of continuous short video playback, surpassing the iPhone 17 with a 5000mAh magnetic charging bank.
Guoxin Technology Develops NPU IP Cores for AI PCs and Robots
Recently, Guoxin Technology revealed on its interactive platform that the company is actively developing NPU IP cores aimed at AI PC and robot applications, further expanding its layout in the field of artificial intelligence.
It is reported that Guoxin Technology has formed a series of products in the NPU field, including NPU IP cores such as CNN20, CNN100, CNN200, and CNN300. Among them, CNN20 and CNN100 have completed design and external authorization, with single-core computing power reaching 1 Tops@INT8, suitable for low-power AI MCU chips. CNN200 is currently under development, with expected single-core computing power reaching 10 Tops@INT8, applicable to various edge computing AI SoC chips, widely used in numerous AI application scenarios including robotic dogs.
CNN300, aimed at AI PC and robot applications, is currently in the development stage. This product combines scalar operation units and vector operation matrices, utilizing dedicated reconfigurable programmable technology to form a general-purpose programmable artificial intelligence accelerator. The single-core performance of CNN300 is expected to reach 8 TOPS, and through multi-core stacking technology, such as a four-core stack, the computing power can be increased to 32 TOPS. Additionally, CNN300 will support data types required for conventional AI applications such as INT8/FP8/FP16, not only supporting traditional CNN and RNN applications but also the latest popular large language model (LLM) applications, such as Deepseek, Qwen, and LLaMa.
Taiwan Halts Chip Export Controls to South Africa
Taiwan has temporarily suspended the chip export controls imposed on South Africa two days ago. The Taiwanese economic department stated on Thursday, “We have decided to suspend the announcement of this notice.”
On September 23, Taiwan restricted chip exports to South Africa for regional security reasons, aiming to leverage its market dominance to pressure the South African government. The Taiwanese trade agency stated in a notice that most chips sold to South Africa currently require prior approval.
The notification period for export restrictions is 60 days, originally set to take effect at the end of November. Given that Taiwan’s data shows that in 2024, Taiwan exported approximately $4 million worth of goods on the suspension list to South Africa, these restrictions may have some symbolic significance.
In response, a foreign ministry spokesperson stated that the Taiwanese authorities’ deliberate interference in the stability of the global chip supply chain will only end in failure. In recent years, the chip industry in mainland China has developed rapidly, with mature process chip production capacity accounting for about 28% of the global total, and significant breakthroughs in advanced process chips. According to South African customs statistics, in 2024, mainland China exported three times the amount of chips to South Africa compared to Taiwan’s chip trade volume with South Africa. The Taiwanese authorities’ measures will not have a substantial impact on South Africa’s related industries, but will only backfire.
Industry Dynamics
Vuzix Partners with TCL Huaxing Optoelectronics to Develop Micro-LED + Waveguide Integration Solutions
Recently, Vuzix Corporation and TCL Huaxing Optoelectronics announced a long-term partnership aimed at developing integrated solutions that combine Micro-LED displays with waveguide optical devices for smart glasses applications. According to InvestingPro data, Vuzix’s stock price surged over 50% in the past week.
According to the announcement, Vuzix’s waveguide features high transparency and extremely low forward light leakage, providing excellent image quality without producing rainbow effects. When combined with TCL Huaxing Optoelectronics’ Micro-LED technology, this solution offers a modular approach that is expected to accelerate adoption by OEM manufacturers and consumer brands.
“The combination of Micro-LED and waveguide optics is a key driver for the next generation of smart glasses,” said Paul Travers, President and CEO of Vuzix.
The two companies are currently developing a full-color Micro-LED and waveguide optical solution, scheduled for release in early 2026. They describe this as an important step towards achieving large-scale adoption in consumer and enterprise augmented reality (AR) applications.
Taiwan Semiconductor Manufacturing Company (TSMC) Expected to Raise Prices by 50% for 2nm Process
Industry media reports that TSMC’s substantial capital expenditure for advanced processes may force it to adopt aggressive pricing strategies to maintain investment returns and process yields in response to “semiconductor inflation.”
Industry insiders find the rumors of a 50% price increase for TSMC’s 2nm process suspicious for two reasons. First, the 2nm process has not yet been mass-produced, so there is no basis for a price increase comparison. Second, TSMC is unlikely to engage in opportunistic pricing, making a 50% increase seem implausible.
Regarding the mass production of 2nm technology, TSMC previously mentioned in a conference call that its 2nm and A16 technologies are leading the industry in meeting the endless demand for energy-efficient computing, with nearly all relevant innovators collaborating with TSMC.
TSMC expects that, driven by smartphones and high-performance computing applications, the number of product design confirmations for 2nm technology in the first two years will exceed that of 3nm and 5nm during the same period.
According to TSMC’s timeline, the 2nm process is expected to enter mass production in the second half of 2025, with a production curve similar to that of 3nm. Under its continuously strengthening strategy, TSMC has also launched the N2P process technology extending the 2nm family, which offers better performance and power efficiency to support high-performance computing applications in smartphones, with mass production expected in the second half of 2026.
Apple’s Vision Air Screen May Use CoE Packaging
Recently, a supply chain report indicated that Apple may introduce CoE packaging technology for OLED screens in two new products set to be released in 2027: the iPhone 20 and Vision Air.
Smartphone displays contain multiple layers of components, such as display layers, touch sensing layers, internal reflection filtering layers, and protective layers, each of which adds thickness, cost, and complexity while reducing light efficiency. Therefore, the market is continuously exploring solutions to reduce the number of layers.
CoE (Color Filter Encapsulation) is a relatively new screen technology that integrates color filters directly into the thin film encapsulation layer of OLEDs and removes the polarizer to achieve a thinner screen, higher brightness, lower power consumption, and better reflection control. This technology was first applied in Samsung’s foldable phones.
Some industry insiders revealed, “Apple plans to apply CoE to flat smartphones in 2027 to commemorate the 20th anniversary of the iPhone’s launch.” Additionally, CoE may also be applied to Apple’s new headset, Vision Air, aiming to make the device lighter and thinner.
New Technology Products
Naxin Microelectronics Launches NS800RT113x Series MCU
Naxin Microelectronics has launched the NS800RT113x series MCU, which is based on the Arm Cortex-M7 core and integrates self-developed mMATH mathematical acceleration cores, high-speed ADCs, fine PWM, and programmable logic modules, fully meeting the stringent application requirements for high performance and real-time capabilities in motor control and power electronics. This release marks the entry of M7 core MCUs into a broader range of application scenarios.
The NS800RT1135/1137 features a 200MHz Cortex-M7 core, supporting ECC with 128~256KB Flash and 80KB TCM (zero-wait memory within the CPU core), all supporting ECC functionality, significantly enhancing real-time computing performance. Coupled with Naxin’s self-developed mMATH mathematical acceleration core, it can efficiently handle trigonometric functions, transcendental functions, and floating-point operations, comprehensively enhancing computational support for control applications.
In the MCU market, the Cortex-M4 core is the most common mainstream choice, while the NS800RT113x series is the first to introduce the Cortex-M7 core into broader applications. Compared to the M4 core, the M7 core improves DMIPS/Hz and CoreMark/Hz by 83% and 49%, respectively, and natively supports TCM within the core, achieving zero-wait access at CPU frequency.
Texas Instruments Launches Ultra-Low-Cost Real-Time Microcontroller
Recently, Texas Instruments launched a cost-effective C2000™ series real-time microcontroller (MCU), helping engineers design industry-leading products at a lower cost. The newly launched F28E120SC and F28E120SB MCUs have improved computing power by 30% compared to previous C2000 MCUs used in single motor and power factor correction systems, enhancing the performance of household appliances and power tools such as washing machines, dishwashers, and vacuum cleaners.
This new MCU series is equipped with TI’s proprietary InstaSPIN™ field-oriented control (FOC) software and advanced algorithms, enabling smoother, quieter, and more energy-efficient motor performance. Its advanced features include high-speed sensorless field-oriented control (FOC), high-torque zero-speed start, and complex vibration compensation technology, helping everyday applications achieve high precision and responsive motor control.
Investment and Financing
Judging Technology Completes Series A Financing
Recently, Nanjing Judging Technology Co., Ltd. (referred to as “Judging Technology”) completed Series A financing, exclusively invested by Changxin Industrial Investment.
Public information shows that Judging Technology was established in June 2023, focusing on the research and production of bottom-filling materials for integrated circuit packaging, engaged in the research and production of high-end adhesive materials for integrated circuit packaging, with products mainly including two types: conductive adhesives and insulating adhesives, primarily applied in semiconductor integrated circuit IC packaging (DIP SOP SSOP QFP LQFP TQFP SOP PLCC SIP QFN), LED, smartphones, electronic assembly, automotive, and other fields.
The core products of Judging Technology—conductive adhesives and insulating adhesives—directly determine the mechanical stability, thermal conductivity efficiency, and signal transmission quality of the packaging structure. As the performance requirements for chips in high-end application scenarios such as 5G, AI, and automotive electronics continue to rise, traditional materials are increasingly unable to meet the demand, making the domestic replacement of high-end adhesive materials a key link in breaking the “bottleneck” of the industrial chain, and Judging Technology’s technological breakthroughs are precisely targeting this link.
Yitang Technology Completes Over 100 Million Series A Financing
Recently, Ningbo Yitang Intelligent Technology Co., Ltd. (referred to as “Yitang Technology”) completed over 100 million Series A financing, led by PwC Capital. This round of financing will be used to accelerate technological breakthroughs, expand high-end production capacity, and explore global markets, fully promoting the domestic replacement process of high-speed, high-precision fully automatic placement machines, supporting Yitang’s domestic high-end electronic manufacturing equipment brand.
In March of this year, Yitang Technology completed its Pre-A round of financing.
Public information shows that Yitang Technology was established in December 2022, incubated by the national-level specialized and innovative “little giant” enterprise Ningbo Intelligent Equipment Research Institute, and has always focused on the research and manufacturing of the ESM series high-speed, high-precision fully automatic placement machines, being one of the few domestic equipment manufacturers capable of replacing imported high-speed, high-precision placement machines, mastering independent intellectual property rights and core technological capabilities for the underlying modules of placement machines, with product performance on par with Japanese and Korean overseas equipment manufacturers, filling the domestic gap in high-speed, high-precision placement machines and breaking the blockade of overseas placement machine manufacturers on military enterprises’ equipment.
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