Guide to Learning Circuit Boards with Embedded Pads and Their Manufacturing Methods
Ten Short Answer Questions
- What field does this invention patent relate to regarding circuit boards?
- According to claim 1, what are the main components of the circuit board with embedded pads?
- According to claim 1, how are the embedded pads formed?
- According to claim 2, how is the multilayer structure of the circuit board formed?
- According to claim 4, what are the characteristics of the connection between the first conductive hole and the second conductive hole?
- According to claim 5, what is the first step in manufacturing the circuit board with embedded pads?
- According to claim 9, what materials can be used for the metal protective layer formed on the surface of the embedded pads?
- According to specification [0013], how can the first copper foil and the second copper foil form conductive circuits?
- According to specification [0037], what types of lasers can be used for the laser drilling technology to form the first conductive hole and the second conductive hole?
- According to specification [0051], how is the embedded pad positioned relative to the first conductive wiring layer?
Answer Key
- This invention patent relates to circuit boards with embedded pads and their manufacturing methods.
- According to claim 1, the circuit board with embedded pads includes at least three conductive wiring layers, and the circuit board has a first surface on which the first conductive wiring layer and multiple embedded pads are formed.
- According to claim 1, multiple embedded pads are arranged in a matrix to form an embedded pad array, which includes multiple outer pads at the outermost layer and multiple center pads surrounded by the outer pads. The outer pads are electrically connected to the first conductive wiring layer, and the center pads are independently formed on the first surface.
- According to claim 2, the circuit board is formed by stacking and pressing the first substrate layer, the first conductive wiring layer and multiple embedded pads, the second substrate layer and the second conductive wiring layer, the third substrate layer and the third conductive wiring layer, etc., to create a multilayer structure.
- According to claim 4, the first conductive hole and the second conductive hole are not electrically connected to the outer pads, and the first conductive hole and the second conductive hole are not simultaneously connected to the same center pad.
- According to claim 5, the first step in manufacturing the circuit board with embedded pads is to provide a first circuit substrate, which includes a first substrate layer and first and second copper foils located on both surfaces of the back of the first substrate layer.
- According to claim 9, the materials for the metal protective layer formed on the surface of the embedded pads can be nickel, gold, or nickel/gold alloy.
- According to specification [0013], the first copper foil and the second copper foil can form conductive circuits through methods such as rolled copper foil, electroplated copper foil, or chemical copper foil.
- According to specification [0037], the laser drilling technology used to form the first conductive hole and the second conductive hole can use YAG lasers, CO2 lasers, or mechanical drilling methods.
- According to specification [0051], only the outermost pad of the embedded pad array closest to the first conductive wiring layer will occupy the surface area of the first conductive wiring layer.
Five Formatting Issues for Papers
- Detail the advantages and technical effects of the circuit board with embedded pads provided by this invention patent compared to existing technologies.
- Based on the implementation methods in the specification, describe in detail the manufacturing process of the circuit board with embedded pads and analyze the technical points of the key steps.
- Analyze the advantages and disadvantages of several methods mentioned in the specification for forming conductive holes (laser drilling, mechanical drilling, electroplating, printing conductive paste) and discuss their applicable scenarios.
- According to the illustrations in the specification, explain the components of the circuit board represented by different numbers and describe their interrelationships.
- Discuss the significance of this invention patent in improving the integration of circuit boards and meeting the trends of consumer electronics towards thinner, smaller, and smarter products.
Glossary of Keywords
- Embedded Pad: Pads formed on the surface or inside of the circuit board for electrical connection with other electronic components.
- Conductive Wiring Layer: A layer formed of conductive material used to carry current and signal transmission.
- Substrate Layer: The supporting layer of the circuit board, usually made of insulating material.
- Copper Foil: The primary material used to form conductive circuits.
- Conductive Hole: A channel connecting different conductive wiring layers.
- Outer Pad: The outermost pads in the embedded pad array.
- Center Pad: The embedded pads surrounded by outer pads.
- Pad Array: A structure where multiple pads are arranged in a specific form.
- Electrical Connection: Connections in the circuit achieved through conductive materials.
- Pressing: The process of bonding multilayer circuit board materials together.
- Drilling: The process of forming holes in the circuit board, which can be mechanical drilling or laser drilling.
- Electroplating: The process of depositing a metal layer on the surface of an object through electrochemical methods.
- Printing Conductive Paste: The process of printing conductive paste onto the circuit board to form conductive circuits.
- Metal Protection Layer: A metal layer formed on the surface of the pads to protect them from oxidation and corrosion.
- Solder Mask Layer: A protective layer covering the surface of the circuit board (except for the pads) to prevent short circuits during soldering.
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