Pengding Holdings involves a new type of flexible printed circuit board and its manufacturing method, which features a double-sided gold finger design aimed at improving space utilization and overcoming the limitations of existing single-sided gold finger flexible circuit boards in achieving circuit layout.
Key Ideas/Facts:
Double-Sided Gold Finger Design: The most significant feature of Pengding Holdings is that the flexible printed circuit board is equipped with gold finger areas on both the front and back sides. This differs from traditional flexible printed circuit boards, which typically only have gold fingers on one side. The document summary explicitly states: “Pengding Holdings involves a flexible printed circuit board and its manufacturing method, which includes a front and back that are opposite to each other, with the front having a front gold finger and the back having a back gold finger positioned in a mirrored location relative to the front.”
Improved Space Utilization: By placing gold fingers on both sides of the flexible printed circuit board, space can be utilized more effectively. As mentioned in the background technology section of the document: “However, due to the presence of a reinforcement plate on the back of the flexible printed circuit board, circuit design cannot be made, leading to low space utilization of the flexible printed circuit board. Therefore, it is necessary to provide a flexible printed circuit board and its manufacturing method that can improve space utilization.” Pengding Holdings addresses this issue with the double-sided gold finger design.
Structure and Composition: The patent details the laminated structure of the flexible printed circuit board, including substrates (such as polyimide), copper foil layers, insulating layers, reinforcement plates, and front and back gold fingers connected through connection areas. The gold fingers are formed through electroplating or chemical gold plating processes.
The document describes an embodiment where the flexible printed circuit board includes a first copper-clad laminate, a first insulating layer, and a second copper-clad laminate, along with a reinforcement unit. The front gold finger is placed on the first copper-clad laminate, while the back gold finger is placed on the second copper-clad laminate.
In different embodiments, the laminated structure and the number of layers vary, but all revolve around the design of double-sided gold fingers. For example, the document mentions, “The flexible printed circuit board includes a reinforcement plate, a third insulating layer, and a fourth adhesive layer, where the reinforcement plate is made of resin containing reinforcing materials, and the third and fourth adhesive layers are respectively bonded to the opposite sides of the reinforcement plate.”
Manufacturing Method: The patent also describes in detail the steps for manufacturing the double-sided gold finger flexible printed circuit board. This typically involves processes such as lamination, forming vias, electroplating, circuit pattern creation, and the formation of gold fingers.
The steps of the manufacturing method include providing copper-clad laminates and reinforcement units, laminating them to form a bonded substrate, and then forming vias and inner copper on the bonded substrate.
The document details the steps for forming the front and back gold fingers, which typically include creating gold finger pads and conductive circuits on the copper foil layer, and electroplating or chemically plating gold on the gold finger pads. For example, “The step of forming the front gold finger on the front of the first copper-clad laminate includes: creating multiple first gold finger pads on the first copper foil layer, with multiple first conductive circuits electrically connected to each of the first gold finger pads.”
Connection and Wiring: The design of double-sided gold fingers allows for more flexible connections and wiring. Through structures such as vias, electrical connections between the front and back can be achieved. The document states: “The flexible printed circuit board has gaps in the areas corresponding to the connection regions, and the gold finger area is smoothly connected to the non-gold finger area through the connection region.” and “The first via passes through the third insulating layer and the sixth adhesive layer, penetrating between the second insulating layer and the third copper foil layer.”
Applications: Due to their lightweight, thin, and foldable characteristics, flexible printed circuit boards are widely used in various electronic products. Pengding Holdings’ improvement in space utilization is expected to find applications in more compact electronic devices. The background technology section of the document mentions: “Flexible printed circuit boards are widely used in various electronic products due to their ability to carry electronic components, connect circuits, small size, light weight, flexibility, and capability for dynamic bending.”
Improvements and Advantages: Compared to traditional flexible printed circuit boards, the advantages of Pengding Holdings lie in improved space utilization, making circuit board design more flexible, which helps save costs and improve assembly efficiency. The document summarizes: “The front of the flexible printed circuit board is equipped with a front gold finger, while the back has a back gold finger, with circuit designs made on both sides. Compared to traditional flexible circuit boards that only design gold fingers on one side, the space utilization of the flexible printed circuit board in this embodiment is higher. Moreover, if the number of conductive circuits and gold finger pads in the two types of flexible printed circuit boards is the same, the area required for the flexible printed circuit board in this embodiment will be reduced, resulting in lower costs.”
Quotations:
“Pengding Holdings involves a flexible printed circuit board and its manufacturing method, which includes a front and back that are opposite to each other, with the front having a front gold finger and the back having a back gold finger positioned in a mirrored location relative to the front.” (Summary)
“Pengding Holdings involves a new type of flexible printed circuit board and its manufacturing method, which features a double-sided gold finger design aimed at improving space utilization and overcoming the limitations of existing single-sided gold finger flexible circuit boards in achieving circuit layout.” (Main purpose implied in the background technology)
“Compared to existing technology, Pengding Holdings’ flexible printed circuit board and its manufacturing method have a front gold finger on the front and a back gold finger on the back, with circuit designs made on both sides, resulting in higher space utilization compared to traditional flexible circuit boards that only design gold fingers on one side.” (Specification page 5 [0007])
“The flexible printed circuit board has gaps in the areas corresponding to the connection regions, and the gold finger area is smoothly connected to the non-gold finger area through the connection region.” (Claim 1)
“It can be understood that the order of the steps for manufacturing the flexible printed circuit board can change, for example, the steps after the sixth step can be arranged as the seventh step, the eighth step, the ninth step, the tenth step, and the twelfth step. Additionally, to manufacture the flexible printed circuit board in the first embodiment, it is only necessary to make the first copper foil layer in the seventh step as the first copper foil layer in the first embodiment, and the second copper foil layer in the eighth step as the second copper foil layer in the first embodiment, with other steps remaining the same, which will not be elaborated here.”
Summary:
Pengding Holdings has proposed a double-sided gold finger flexible printed circuit board, which effectively improves space utilization by placing gold fingers on both the front and back of the circuit board, overcoming the shortcomings of existing technology. The patent details the laminated structure and manufacturing method of this circuit board, providing a new solution for the design of more compact and efficient electronic devices.
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