Manufacturing Methods

Manufacturing Method for Shadow Processing of Rigid-Flex Circuit Boards

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Manufacturing Method for Shadow Processing of Rigid-Flex Circuit Boards

Key Technical Field: This involves the field of electronic products, particularly the design and manufacturing technology of rigid-flex circuit boards. Overview of Background Technology: With the continuous development of consumer electronic products, the requirements for circuit boards are becoming increasingly high, including aspects such aslightweight, easy assembly, signal transmission speed, and product reliability. The rigid-flex … Read more

Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards

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Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards

Guide to Flexible Circuit Boards and Their Manufacturing Methods Overview This guide aims to help you review and understand the structure of flexible circuit boards and their manufacturing methods as described. The patent discloses a design for flexible circuit boards intended to reduce high-frequency signal transmission losses by introducing air-filled sealed cavities to minimize dielectric … Read more

Design of Double-Sided Gold Fingers in Flexible Circuit Boards

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Design of Double-Sided Gold Fingers in Flexible Circuit Boards

Pengding Holdings involves a new type of flexible printed circuit board and its manufacturing method, which features a double-sided gold finger design aimed at improving space utilization and overcoming the limitations of existing single-sided gold finger flexible circuit boards in achieving circuit layout. Key Ideas/Facts: Double-Sided Gold Finger Design: The most significant feature of Pengding … Read more

Innovative Circuit Board with Solder Pads and Its Manufacturing Method

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Innovative Circuit Board with Solder Pads and Its Manufacturing Method

Core Issues and Technical Background: Pengding Holdings addresses the trend of existing electronic products moving towards being thinner, lighter, and smarter, where flexible circuit boards (FPC) are widely used as important components. To achieve high frequency, high speed, thinness, and dense routing, as well as to meet the requirements of Ball Grid Array (BGA) packaging, … Read more

Guide to Manufacturing Rigid-Flex Circuit Boards

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Guide to Manufacturing Rigid-Flex Circuit Boards

Guide to the Research and Manufacturing Methods of Rigid-Flex Circuit Boards This research guide aims to help you understand and review the described rigid-flex circuit boards and their manufacturing methods. Quiz Please briefly answer the following questions in 2-3 sentences. What is the technical field described in the patent document? What advantages do rigid-flex circuit … Read more