High-speed rail circuit boards and standard circuit boards exhibit significant differences in design, material selection, and manufacturing processes, primarily due to the unique requirements imposed by the operating environment of high-speed trains on electronic devices. The following are the main differences between high-speed rail circuit boards and standard circuit boards:
- Reliability and Durability
High-speed rail circuit boards: Due to the high-speed operation of trains and the need to function stably in various harsh environments (such as extreme temperatures, humidity, vibrations, etc.), there are extremely high requirements for the reliability and durability of circuit boards. This often means using higher quality materials and stricter manufacturing standards.
Standard circuit boards: In contrast, standard circuit boards may not face such harsh working conditions, so their design focuses more on cost-effectiveness and basic functionality. - Temperature Resistance
High-speed rail circuit boards: To accommodate the heat generated during high-speed operation and changes in external environmental temperatures, high-speed rail circuit boards often use substrates with better heat resistance, such as polyimide, and may include additional heat dissipation designs.
Standard circuit boards: Typically use common substrates like FR-4, which, while having some temperature resistance, do not perform as well under extreme conditions compared to materials specifically designed for high-speed rail. - Vibration Resistance
High-speed rail circuit boards: Considering the continuous vibrations during train operation, high-speed rail circuit boards must possess greater mechanical strength and vibration resistance. This may involve special reinforcement techniques or the use of more robust component packaging.
Standard circuit boards: For most applications, standard vibration-resistant designs are sufficient to meet everyday usage needs. - Electromagnetic Compatibility (EMC)
High-speed rail circuit boards: During high-speed movement, high-speed trains encounter complex electromagnetic environments, so the circuit boards must have good electromagnetic compatibility to prevent signal interference. Shielding layers or other EMC protection measures may be incorporated into the design.
Standard circuit boards: While EMC issues also need to be considered, the requirements are lower compared to those for high-speed rail circuit boards. - Safety
High-speed rail circuit boards: Due to the involvement of public transportation safety, the design of high-speed rail circuit boards must comply with strict safety standards to ensure passenger safety even in the event of a failure.
Standard circuit boards: Safety standards depend on specific application scenarios, but for non-critical applications, the safety requirements are relatively lenient. - Manufacturing Precision
High-speed rail circuit boards: To meet all the aforementioned high standards, the manufacturing process of high-speed rail circuit boards typically requires higher precision, including fine line production and the application of high-density interconnect (HDI) technology.
Standard circuit boards: Depending on actual usage, the manufacturing precision of standard circuit boards can vary significantly.
In summary, high-speed rail circuit boards impose stricter requirements than standard circuit boards in multiple aspects, from material selection to production processes, and to the final product testing and validation. Each step is aimed at ensuring that the circuit boards can operate stably over the long term in the specific and demanding working environment of high-speed rail.