
MTK MediaTek Platform
4G Android Core Board:
XY6739CW (Based on MT6739):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY8766(Based on MT8766):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY6762(Based on MT6762/Helio P22):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY8768(Based on MT8768):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY6765CA(Based on MT6765/Helio P35):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY6771CZ(Based on MT6765/Helio P60):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY8788WA-F(Based on MT8788/I500P):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY6785CD(Based on MT6785/Helio G95):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY6769(Based on MT6769):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY8786(Based on MT8786): SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY6789 (Based on MT6789/Helio G99): SupportsUSB 2.0High-Speed Mode; Supports USB OTG
5G Android Core Board:
XY6853ZA(Based on MT6853 Dimensity 720):SupportsUSB 3.0DEVICE mode, maximum transfer rate of 5.0GBPS, supports USB 2.0 OTG
XY6833ZA(Based on MT6833 Dimensity 700):SupportsUSB 3.0DEVICE mode, maximum transfer rate of 5.0GBPS, supports USB 2.0 OTG
XY6877ZA(Based on MT6877 Dimensity 900):SupportsUSB 3.0DEVICE mode, maximum transfer rate of 5.0GBPS, supports USB 2.0 OTG
XY6897(Based on MT6897 Dimensity 8300):SupportsUSB 3.0, supports USB 2.0 OTG mode
XY8390(Based on MT8390/Genio 700):Supports1*USB 3.1, 2*USB 2.0
Unisoc Platform
4G Android Core Board:
XY310(Based on Tiger T310):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY610(Based on Tiger T610):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY616(Based onTiger T616):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
XY618(Based on Tiger T618):SupportsUSB 2.0High-Speed Mode; Supports USB OTG
5G Android Core Board:
XY820(Based onT820/T9100):SupportsUSB 3.0 or USB 2.0 OTG mode
USB Versions
USB 1.0 version, USB LS (Low Speed), speed 1.5Mbps;
USB 1.1 version, USB FS (Full Speed), speed 12Mbps;
USB 2.0 version, USB HS (High Speed), speed 480Mbps;
USB 3.0 version, USB SS (Super Speed), speed 5Gbps. Also known as USB 3.1 Gen 1 or USB 3.2 Gen 1;USB 3.1 version, USB SS (Super Speed), speed 10Gbps. Also known as USB 3.2 Gen 2;
USB 3.2 is a renaming of the USB 3.0 and USB 3.1 standards. USB 3.2 version, USB SS (Super Speed), speed 20Gbps;
USB 3.2 Gen 1: Also known as USB 3.0 or USB 3.1 Gen 1, transfer speed of 5Gbps;
USB 3.2 Gen 2: Also known as USB 3.1 Gen 2, transfer speed of 10Gbps;
USB 3.2 Gen 2×2:Currently, only Type C supports this protocol, transfer speed up to 20Gbps;
USB 4:Transfer speed up to 40Gbps, the latest USB4 standard currently only supports Type-C interface, and USB4 adopts the Thunderbolt protocol.
USB 2.0 Pin Definitions
USB 2.0 uses a design with four pins in a single row
| Pin | Name | Description |
| 1 |
VBUS |
Power Voltage +5V |
| 2 |
D- |
2.0 Data Signal |
| 3 |
D+ |
2.0 Data Signal |
| 4 |
GND |
Ground |

USB 3.0 Pin Definitions
USB 3.0 uses a design with two rows of nine pins
| Pin |
A Type Connector |
B Type Connector |
Description |
| 1 |
VBUS |
VBUS |
Power, +5V |
| 2 |
D- |
D- |
2.0 Data Differential Pair, Data- |
| 3 |
D+ |
D+ |
2.0 Data Differential Pair, Data+ |
| 4 |
GND |
GND |
Power Ground, GND |
| 5 |
StaA_SSRX- |
StaB_SSRX- |
High-Speed Data Differential Pair, RX- |
| 6 |
StaA_SSRX+ |
StaB_SSRX+ |
High-Speed Data Differential Pair, RX+ |
| 7 |
GND_DRAIN |
N/A | Signal Ground |
| 8 |
StaA_SSTX- |
StaB_SSTX- |
High-Speed Data Differential Pair, TX- |
| 9 |
StaA_SSTX+ |
StaB_SSTX+ |
High-Speed Data Differential Pair, TX+ |
USB Power Supply Support

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New Move TechnologyLeading IoT Solution Provider
About New Move Technology Co., Ltd.
Shenzhen New Move Technology Co., Ltd. is a leading provider of mobile communication technology and IoT solutions, integrating technology research and development, product manufacturing, system integration, and product sales as a national high-tech enterprise and a national specialized and innovative enterprise.
The company established an SMT manufacturing subsidiary in 2018, with professional production equipment and modern production workshops, providing strong support for the production of core modules and customer-customized PCBA projects, offering a full range of services from R&D to manufacturing.
The company is headquartered in Bao’an, Shenzhen, with a research and development center in Changsha, focusing on mobile communication technology (2G/3G/4G/5G) and Android smart IoT technology (Android, IoT).
Based on years of technical reserves and resource accumulation in the communication field, the company has established comprehensive strategic partnerships with globally renowned mobile chip manufacturers such as MediaTek (MTK), Unisoc, and Qualcomm, receiving strong technical support from chip manufacturers. Our company keeps pace with major mobile chip manufacturers, continuously launching powerful Android communication modules, thereby providing customers with stable, reliable, and high-performance smart IoT hardware platforms. We provide comprehensive technical support covering the entire process from R&D, manufacturing, to supply chain, thus providing strong support for customers to quickly launch products. The successfully developed Android mainboards based on MediaTek, Unisoc, and Qualcomm platforms have been widely used in smart handheld terminals, POS machines, advertising machines, robots, smart homes, industrial control, vehicle navigation, security monitoring, mobile medical, education and training, and IoT-related fields.
Contact Us
Company Headquarters: 4th Floor, Jin Yuan Business Building A, No. 300 Xixiang Avenue, Bao’an District, Shenzhen
Customer Hotline: Mr. Liu, Phone and WeChat same number 18688981861