In the semiconductor manufacturing process, the quality of ultra-pure water directly affects chip yield and performance. As the global semiconductor industry chain becomes more integrated, understanding and complying with different regions’ ultra-pure water standards has become crucial for enterprises to ensure compliant production.
This article deeply compares the definitions of ultra-pure water according to SEMI (Semiconductor Equipment and Materials International), ISO (International Organization for Standardization), and China’s GB standards, with a particular emphasis on the certification requirements that export enterprises need to pay attention to, helping companies maintain a compliance advantage in global competition.
1. Overview of the Three Major Standard Systems
The demand for ultra-pure water in the semiconductor industry has led to the emergence of multiple standard systems, among which SEMI, ISO, and China’s GB standards are the most influential.
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SEMI Standards are established by the Semiconductor Equipment and Materials International and are the de facto international standards in the semiconductor industry, adopted by most semiconductor manufacturers worldwide. The SEMI F63 standard specifically stipulates the quality requirements for ultra-pure water used in semiconductor manufacturing, characterized by strict parameter settings optimized for semiconductor process characteristics.
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ISO Standards are published by the International Organization for Standardization, with standards such as ISO 14644-1 and ISO 3696 addressing pure water quality, but they are not as specialized as SEMI. ISO standards are more general and applicable to various industrial fields, with relatively relaxed parameter settings, but a well-established certification system, making them highly accepted in the European market.
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China’s GB Standards, represented by the GB/T 11446 series, have been increasingly aligning with international standards in recent years. The GB standards consider both the need for international alignment and the characteristics of China’s water quality and industrial realities, providing more guidance for domestic enterprises. Notably, the Chinese standards impose stricter requirements on certain specific pollutants (such as silicon content) than international standards.
2. Comparison of Key Parameter Definitions
There are significant differences in the definitions of ultra-pure water among the three major standards, mainly reflected in the following key parameters:
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Resistivity: SEMI F63 requires ultra-pure water resistivity to be ≥18.2 MΩ·cm (25°C), which is the gold standard in the semiconductor industry; ISO 3696 classifies pure water into three grades, with the highest grade only requiring ≥10 MΩ·cm; GB/T 11446.1-2013 fully adopts the SEMI standard of 18.2 MΩ·cm.
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TOC (Total Organic Carbon) Content: The SEMI standard stipulates TOC ≤1 ppb (parts per billion); the ISO standard has no specific requirement; GB/T 11446.1-2013 sets the TOC limit for EW-I grade ultra-pure water at ≤5 ppb, slightly lower than SEMI’s requirement.
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Particulate Control: SEMI has the strictest limits on particles larger than 0.05μm, requiring ≤1 particle/mL; ISO has no specific regulations; the GB standard references SEMI but allows for slightly higher particulate content.
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Microbial Indicators: SEMI requires bacterial content <0.001 CFU/mL; ISO 14644-1 has classifications for microorganisms but does not specifically target water; GB/T 11446.1-2013 stipulates that EW-I grade ultra-pure water should have bacterial content <0.01 CFU/mL.
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Dissolved Gases: SEMI has strict requirements for dissolved oxygen (≤5 ppb), while ISO and GB standards do not have specific regulations on this. This parameter is specifically set by the SEMI standard to meet semiconductor process needs.
3. Differences in Technical Concepts Behind the Standards
These parameter differences reflect the technical concepts of different standard systems:
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SEMI Standards are entirely service-oriented to semiconductor manufacturing processes, with parameter settings directly related to the actual needs of wafer production. For example, the extremely low TOC requirement is to prevent organic materials from forming carbonized residues on the wafer surface; strict dissolved oxygen control reduces the occurrence of oxidation defects.
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ISO Standards adopt a